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Materials for High-Density Electronic Packaging and Interconnection

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Status: Available Now

Size: 156 pages, 8.5 x 11

Publication Year:1990

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PAPERBACK ISBN-10: 0-309-04233-X ISBN-13: 978-0-309-04233-8	$19.00	$17.10	Add to Cart

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Authors:
Committee on Materials for High-Density Electronic Packaging, Commission on Engineering and Technical Systems, National Research Council
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Table of Contents
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FRONT MATTER	i-xiv	(skim)
EXECUTIVE SUMMARY	1-8	(skim)
1 INTRODUCTION	9-20	(skim)
2 MICROELECTRONIC SYSTEM TRENDS AND PACKAGING NEEDS	21-40	(skim)
3 PACKAGING STRATEGIES AND ASSOCIATED MATERIALS AND PROCESS REQUIREMENTS	41-58	(skim)
4 MATERIALS ISSUES	59-70	(skim)
5 SOME SPECIFIC MATERIALS	71-94	(skim)
6 ORGANIZATIONAL, FUNDING, AND POLICY ISSUES	95-104	(skim)
APPENDIX A: GLOSSARY OF SOME TERMS AND ACRONYMS USED IN THE REPORT	105-108	(skim)
APPENDIX B: SOME INDUSTRY COMPONENT DATA	109-114	(skim)
APPENDIX C: MICROPROCESSOR OPERATING AND STRUCTURAL PARAMETERS	115-118	(skim)
APPENDIX D: EXAMPLES OF DEVELOPMENTS IN BOARD TECHNOLOGIES	119-122	(skim)
APPENDIX E: MATERIALS PROPERTIES	123-126	(skim)
APPENDIX F: EXAMPLES OF MULTICHIP MODULES	127-134	(skim)
APPENDIX G: BIOGRAPHICAL SKETCHES OF COMMITTEE MEMBERS	135-139	(skim)

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