2014 has become 2013, and it further contemplates moving from a 3-year cycle to a 2-year cycle, thus potentially moving 2013 goals up to 2007. Suppliers have to promise the delivery of tools by 2007 to meet the new product requirements.

The next stage is commercialization. Now that the basic technology is developed and companies have chosen EUV lithography to etch the next generation of chips, the subsequent challenges are how to build the appropriate infrastructure and accelerate the training.

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