Organization of the Laboratory

The four divisions within EEEL—the Electromagnetics Division, the Quantum Electrical Metrology Division, the Optoelectronics Division, and the Semiconductor Electronics Division—undertake a broad range of activities.

The Electromagnetics Division is divided into three groups:

  • The Radio-Frequency Electronics Group concentrates on guided electromagnetic transmission and includes microwave measurement services, micro/nanoelectronics, and electromagnetic properties.

  • The Radio-Frequency Fields Group includes antenna theory, applications, and near-field measurements; reference fields and probes; complex fields; and time-domain fields.

  • The Magnetics Group includes high-current applications, superconductor and magnetic measurements, magnetodynamics, spin electronics, magnetic devices and nanostructures, and microsystems for bioimaging.

The Quantum Electrical Metrology Division is divided into three groups:

  • The Fundamental Electrical Metrology Group works on projects involving voltage, resistance, single-electron tunneling, AC-DC difference, and the electronic kilogram.

  • The Applied Electrical Metrology Group concentrates on electrical power and impedance.

  • The Quantum Devices Group covers quantum voltage, quantum sensors, quantum information, and advanced materials and operates a quantum fabrication facility.

The Optoelectronics Division is divided into three groups:

  • The Sources and Detectors Group works on laser radiometry, display metrology, and high-speed measurements.

  • The Optical Fiber and Components Group works on interferometry and polarimetry and spectral and nonlinear properties.

  • The Optoelectronic Manufacturing Group includes projects on quantum information and terahertz technology, optical materials metrology, nanostructure fabrication and metrology, and semiconductor growth and devices.

The Semiconductor Electronics Division is also organized into three groups:

  • The Enabling Devices and Integrated Circuits Group concentrates on power device and thermal metrology, micro/nanotechnology (MNT), and nanobiotechnology.

  • The complementary metal oxide semiconductor (CMOS) and Novel Devices Group is concerned with nanoelectronic device metrology, macroelectronics, and advanced metal oxide semiconductor (MOS) device reliability and characterization.

  • The Electronic Information Group includes infrastructure for integrated electronics design and manufacturing and knowledge facilitation.



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An Assessment of the National Institute of Standards and Technology Electronics and Electrical Engineering Laboratory: Fiscal Year 2007 Organization of the Laboratory The four divisions within EEEL—the Electromagnetics Division, the Quantum Electrical Metrology Division, the Optoelectronics Division, and the Semiconductor Electronics Division—undertake a broad range of activities. The Electromagnetics Division is divided into three groups: The Radio-Frequency Electronics Group concentrates on guided electromagnetic transmission and includes microwave measurement services, micro/nanoelectronics, and electromagnetic properties. The Radio-Frequency Fields Group includes antenna theory, applications, and near-field measurements; reference fields and probes; complex fields; and time-domain fields. The Magnetics Group includes high-current applications, superconductor and magnetic measurements, magnetodynamics, spin electronics, magnetic devices and nanostructures, and microsystems for bioimaging. The Quantum Electrical Metrology Division is divided into three groups: The Fundamental Electrical Metrology Group works on projects involving voltage, resistance, single-electron tunneling, AC-DC difference, and the electronic kilogram. The Applied Electrical Metrology Group concentrates on electrical power and impedance. The Quantum Devices Group covers quantum voltage, quantum sensors, quantum information, and advanced materials and operates a quantum fabrication facility. The Optoelectronics Division is divided into three groups: The Sources and Detectors Group works on laser radiometry, display metrology, and high-speed measurements. The Optical Fiber and Components Group works on interferometry and polarimetry and spectral and nonlinear properties. The Optoelectronic Manufacturing Group includes projects on quantum information and terahertz technology, optical materials metrology, nanostructure fabrication and metrology, and semiconductor growth and devices. The Semiconductor Electronics Division is also organized into three groups: The Enabling Devices and Integrated Circuits Group concentrates on power device and thermal metrology, micro/nanotechnology (MNT), and nanobiotechnology. The complementary metal oxide semiconductor (CMOS) and Novel Devices Group is concerned with nanoelectronic device metrology, macroelectronics, and advanced metal oxide semiconductor (MOS) device reliability and characterization. The Electronic Information Group includes infrastructure for integrated electronics design and manufacturing and knowledge facilitation.

OCR for page 5
An Assessment of the National Institute of Standards and Technology Electronics and Electrical Engineering Laboratory: Fiscal Year 2007 There are two other organizational groups within EEEL: the Office of Law Enforcement Standards (OLES) and the Office of Microelectronics Programs (OMP). These groups were not subject to the formal assessment process. Early in 2007 each division in EEEL prepared an internal report detailing the division’s programs, activities, and accomplishments (EM-NISTIR 7371, QEM-NISTIR 7370, OE-NISTIR 7369, and SED-NISTIR 7368). These reports describe each division’s mission and its organization into groups and projects. They detail each project’s technical activities, manpower, goals, services, and recent accomplishments. It is clear that the new strategic planning initiatives at EEEL have been effective, since these reports have become much more useful in the review assessment process. The activities are clearly described, the plans and goals are specific, often with technical targets and target dates, and the results are concisely described and supported by publication citations. The reports have been very helpful in responding to the panel’s charge. The divisional reports are detailed, typically 80 pages long and quite comprehensive. The present assessment does not summarize these reports but comments on how they apply to assessment issues. With this in mind, this report does not attempt to describe each project’s activities, goals, impacts, costs, and the like, except where such a description is needed to support a particular assessment comment. The reader is encouraged to refer to the EEEL divisional reports for further background information.