. "V. The Problem – Balancing Perspectives." Review of the Naval Sea Systems Command (NAVSEA) Draft Memorandum: NAVSEA's 21st Century Engagement, Education, and Technology Initiative. Washington, DC: The National Academies Press, 2008.
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Review of the Naval Sea Systems Command (NAVSEA) Draft Memorandum, "NAVSEA’s 21st Century Engagement, Education, and Technology Initiative"
respondents in the NAS study indicated the US as the primary place for STEM development.29
At the Naval Enterprise level, comprising the entire DoN community, the Navy and Marine Corps must attract, develop, retain, and motivate these professionals to ensure our national security through technological innovation.
At the NAVSEA organizational level, our work environment must provide the incentives, equal opportunity, and quality of life that mine diverse viewpoints and capabilities to provide the best possible capabilities to support our national security.
NAVSEA further recognizes a multitude of stakeholders at each of these levels—each with sometimes complementary, but often differing priorities. While all view the problem through their unique lens, success will require the ability to communicate across and balance these perspectives.
Stakeholders at the strategic level include the American public, students at all levels, industry, federal government agencies, and foreign nations. At the Naval Enterprise and NAVSEA organizational levels, the stakeholders include the Department of Defense (DOD), the DoN, NAVSEA, educational institutions, the engineering and scientific workforce, employers, educators, local and state governments, professional societies, labor unions, and others with a record of success in training, retraining and rewarding capable people.30
The initiative addresses:
NAS Storm Report, p. ES-9
Bryan, L.A. “Trying Times For U.S. Engineers”, A Statement on behalf of The Institute of Electrical and Electronics Engineers—United States of America at the Pan Organizational Summit on the U.S. Science and Engineering Workforce, November 12, 2002 IEEE, p. 3