duction—low compared to that of discrete components—it offers reduced systems cost, and in many systems improved performance has been realized.

Integrated electronics will make electronic techniques more generally available throughout all of society, performing many functions that presently are done inadequately by other techniques or not done at all. The principal advantages will be lower costs and greatly simplified design—payoffs from a ready supply of low-cost functional packages.

For most applications, semiconductor integrated circuits will predominate. Semiconductor devices are the only reasonable candidates presently in existence for the active elements of integrated circuits. Passive semiconductor elements look attractive too, because of their potential for low cost and high reliability, but they can be used only if precision is not a prime requisite.

Silicon is likely to remain the basic material, although others will be of use in specific applications. For example, gallium arsenide will be important in integrated microwave functions. But silicon will predominate at lower frequencies because of the technology which has already evolved around it and its oxide, and because it is an abundant and relatively inexpensive starting material.

IV. COSTS AND CURVES

Reduced cost is one of the big attractions of integrated electronics, and the cost advantage continues to increase as the technology evolves toward the production of larger and larger circuit functions on a single semiconductor substrate. For simple circuits, the cost per component is nearly inversely proportional to the number of components, the result of the equivalent piece of semiconductor in the equivalent package containing more components. But as components are added, decreased yields more than compensate for the increased complexity, tending to raise the cost per component. Thus there is a minimum cost at any given time in the evolution of the technology. At present, it is reached when 50 components are used per circuit. But the minimum is rising rapidly while the entire cost curve is falling (see graph). If we look ahead five years, a plot of costs suggests that the minimum cost per component might be expected in circuits with about 1000 components per circuit (providing such circuit functions can be produced in moderate quantities). In 1970, the manufacturing cost per component can be expected to be only a tenth of the present cost.

The complexity for minimum component costs has increased at a rate of roughly a factor of two per year (see graph). Certainly over the short term this rate can be expected to continue, if not to increase. Over the longer term, the rate of increase is a bit more uncertain, although there is no reason to believe it will not remain nearly constant for at least ten years. That means by 1975, the number of components per integrated circuit for minimum cost will be 65 000.

I believe that such a large circuit can be built on a single wafer.

image

Fig. 1.

V. TWO-MIL SQUARES

With the dimensional tolerances already being employed in integrated circuits, isolated high-performance transistors can be built on centers two-thousandths of an inch apart. Such a two-mil square can also contain several kilohms of resistance or a few diodes. This allows at least 500 components per linear inch or a quarter million per square inch. Thus, 65 000 components need occupy only about one-fourth a square inch.

On the silicon wafer currently used, usually an inch or more in diameter, there is ample room for such a structure if the components can be closely packed with no space wasted for interconnection patterns. This is realistic, since efforts to achieve a level of complexity above the presently available integrated circuits are already under way using multilayer metallization patterns separated by dielectric films. Such a density of components can be achieved by present optical techniques and does not require the more exotic techniques, such as electron beam operations, which are being studied to make even smaller structures.

VI. INCREASING THE YIELD

There is no fundamental obstacle to achieving device yields of 100%. At present, packaging costs so far exceed the cost of the semiconductor structure itself that there is no incentive to improve yields, but they can be raised as high as is economically justified. No barrier exists comparable to the thermodynamic equilibrium considerations that often limit yields in chemical reactions; it is not even necessary to do any fundamental research or to replace present processes. Only the engineering effort is needed.

In the early days of integrated circuitry, when yields were extremely low, there was such incentive. Today ordinary integrated circuits are made with yields comparable with those obtained for individual semiconductor devices. The same pattern will make larger arrays economical, if other considerations make such arrays desirable.



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