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Materials for High-Density Electronic Packaging and Interconnection (1990)
National Materials Advisory Board (NMAB)

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. "APPENDIX C: MICROPROCESSOR OPERATING AND STRUCTURAL PARAMETERS." Materials for High-Density Electronic Packaging and Interconnection. Washington, DC: The National Academies Press, 1990.

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Appendix C MICROPROCESSOR OPERATING AND STRUCTURAL PARAMETERS Progress in operating and structural parameters of microprocessors has been rapid in recent years. The progress and future projections are shown in the accompanying figures, C-l through C-4. These figures were prepared from information drawn from trade journals, forecasting reports, and the direct knowledge of committee members of developments in the field. It should be clear that predictions beyond 10 years are hazardous, at best. 115

OCR for page 116

OCR for page 117
117 100 20 10 3 3 2 1 0.5 0.2 0.1 _ I I I I I I I I I I I I I i i.: I.. ~ ..:~: ~ . I.:.. :'. a:: ~ :.: ~ _: : 1 1 _ ·. ,~ 1 1 1 1 1 980 1 990 YEAR Figure C-1 Microprocessor power requirements: 103 9 8 7 6 5 4 3 2 ~ 102 _ 9 8 7 6 5 4 3 2 1 2000 history and forecast 1 1 o 1 1980 1 990 YEAR 2000 Figure C-2 Microprocessor lead count (I/O): history and forecast.

OCR for page 118
118 107 1o6 105 C, 104 103 ~ 1 1 1 o 2 1980 1 990 2000 YEAR Figure C-3 Microprocessor gate count: history and forecast. 109 8 6 4 3 2 1o8 8 _ ^ 6 _ I, 4 _ ~ 3 _ y 2 _ O 107 _ 8 6 4 3 2 1o6 1 1 1 1 1 1 1 1 1 1 1 1 - 1 1 1 1 1 1 1 1 1 1 1 1 2000 1 980 YEAR 1 990 Figure C-4 Microprocessor clock rate: history and forecast

Representative terms from entire chapter:

microprocessor operating