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Appendix D 1 EXAMPLES OF DEVELOPMENTS IN BOW TECHNOLOGIES Various technologies have been developed for assembling complex circuits employing novel circuit and interconnect designs. Some objectives include attempts to minimize the interconnect lengths and make manufacturing reasonably simple, with the possibility of disassembly for repair and circuit changes Two of these are shown in the accompanying figures, D-1 and D-2, based on sketches furnished by TRW. 119

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121 HIGH SPEED SIGNAL PROCESSOR .. FUNCTIONAL UNIT l/o BASE PLATE At\ "~EAT EXCHANGER" ICOLO PLATE OR 5.6 IN. ~ 9 l] ; EQUIVALENT) ~ ~ ~ _ a/ ~ i k~ ~ SPACER ~ ~ SUPER He ' HEAT SINK ' BMAOSUENT~G it; CONDUCTIVE PLUGS at. GOLD PLATED C - . ~ a. -CONTACT ~SURf ACE INSULATOR SPACER BOARD BUTTONS I ._ COMBINATION BUTTON BOARD SPACER (ALTERNATE CONfl0) (0.144 THICK) INTERCONNECT MULTILAYER BOARD (UNPOPULATED) (TEFLON GLASS) BOARD SPACER (0 080 THICK) BUTTON BOARDS TYPICAL (0.032 THICK) / CLAMP STRUCTURE BOI ~ (TYP) Figure D-1 Circuit assembly employing button board technology for face-to- face interconnection of modules. (Courtesy of TRW) FORCE / 2 SIDED PC BOARD . , BUTTON ~' BCOTA8ROAR: FORCE ~ PC 50ARD 2 SiOED PC BOARD 1 ~ PLATED FoRCE THRU HOLES PLATED THRU HOLES Figure D-2 Button board interconnection concept developed by TRW. (Courtesy of TRW)

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