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Materials for High-Density
Electronic Packaging and
Interconnection
Report of the Committee on
Materials for High-Density Electronic Packaging
NATIONAL MATERIALS ADVISORY BOARD
COMMISSION ON ENGINEERING AND TECHNICAL SYSTEMS
NATIONAL RESEARCH COUNCIL
NMAB-449
National Academy Press
1990
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NOTICE: The project that is the subject of this report was approved by the Governing Board of the
National Research Council, whose members are drawn from the councils of the National Academy
of Sciences, the National Academy of Engineering, and the Institute of Medicine. The members of
the committee responsible for the report were chosen for their special competences and with regard
for appropriate balance.
This report has been reviewed by a group other than the authors according to procedures
approved by a Report Review Committee consisting of members of the National Academy of
Sciences, the National Academy of Engineering, and the Institute of Medicine.
The National Academy of Sciences is a private, nonprofit, self-perpetuating society of
distinguished scholars engaged in scientific and engineering research, dedicated to the furtherance
of science and technology and to their use for the general welfare. Upon the authority of the charter
granted to it by the Congress in 1863, the Academy has a mandate that requires it to advise the
federal government on scientific and technical matters.
Dr. Frank Press is president of the National Academy of Sciences.
The National Academy of Engineering was established in 1964, under the charter of the
National Academy of Sciences, as a parallel organization of outstanding engineers. It is autonomous
in its administration and in the selection of its members, sharing with the National Academy of
Sciences the responsiblity for advising the federal government. The National Academy of
Engineering also sponsors engineering programs aimed at meeting national needs, encourages
education and research, and recognizes the superior achievements of engineers. Dr. Robert M. White
is president of the National Academy of Engineering.
The Institute of Medicine was established in 1970 by the National Academy of Sciences to
secure the services of eminent members of appropriate professions in the examination of policy
matters pertaining to the health of the public. The Institute acts under the responsibility given to
the National Academy of Sciences by its congressional charter to be an advisor to the federal
government and, upon its own initiative' to identify issues of medical care' research, and education.
Dr. Samuel O. Thier is president of the Institute of Medicine.
The National Research Council was organized by the National Academy of Sciences in 1916
to associate the broad community of science and technology with the Academy's purposes of
furthering knowledge and advising the federal government. Functioning in accordance with general
policies determined by the Academy, the Council has become the principal operating agency of both
the National Academy of Sciences and the National Academy of Engineering in providing services
to the government, the public, and the scientific and engineering communities. The Council is
administered jointly by both Academies and the Institute of Medicine. Dr. Frank Press and Dr.
Robert M. White are chairman and vice chairman, respectively, of the National Research Council.
This study by the National Materials Advisory Board was conducted under Contract No. MDA 903-
89-K-0078 with the U.S. Department of Defense and the National Aeronautics and Space
Administration.
Library of Congress Catalog Card Number 90-60385.
International Standard Book Number 0-309-04233X
This report is available from the Defense Technical Information Center, Cameron Station,
Alexandria, VA 22304-6145.
SO116
Cover: Schematic cross section of a molded plastic leaded chip carrier
(Courtesy of AT&T Bell Laboratories)
Printed in the United States of America
First Printing, April 1990
Second Printing, November 1990
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ABSTRACT
Electronic packaging and interconnections are the elements that today
limit the ultimate performance of advanced electronic systems. Materials in
use today and those becoming available are critically examined to ascertain what
actions are needed for U.S. industry to compete favorably in the world market
for advanced electronics. Materials and processes are discussed in terms of the
final properties achievable and systems design compatibility. Weak points in
the domestic industrial capability, including technical, industrial philosophy,
and political, are identified. Recommendations are presented for actions that
could help U.S. industry regain its former leadership position in advanced
semiconductor systems production.
. . .
111
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PREFACE
What is packaging? The subject of this report is commonly referred to
as electronic packaging, but the term '"packaging" carries connotations that
tend to trivialize the highly technical and critically important electronic
context. Electronic packaging now goes well beyond physical protection and
includes electric power distribution, signal transmission between integrated
circuits, and, of growing importance, the removal of heat associated with the
very high densities of circuit elements that are being achieved. Modern
system performance is as much limited by these functions as by the operation
of the integrated circuits. Thus, electronic packaging and interconnection
are essential enabling technologies that underlie vital computer and other
electronic applications. Success in integrating these enabling technologies
into the nation's microelectronics efforts is directly related to how well the
United States will succeed as a major competitive force.
The specific subject of this report is the materials employed in high-
density electronic packaging and interconnection. Materials issues are
closely coupled to other systems design factors, and all materials advances
must be coordinated as the field progresses. A successful competitive
position cannot be maintained without leading-edge materials engineering and
science. Coordination of physical design, materials properties, and materials
processing is essential. The competitive position of the United States in an
area of the highest leverage is at stake.
This report focuses on first- and second-level packaging--i.e., the
integrated circuit chip package and the printed circuit to which the chips are
attached. The connectors, backplanes, cables, and other higher-level
interconnect structures have been omitted because it was perceived that
materials problems in these areas were less urgent. In addition, the higher
interconnection levels are, at present, undergoing some degree of conversion
from electrical to optical, and optical interconnections are outside the scope
of this study. The committee believes that optical interconnection is a very
important technology and will certainly spread to the board level and beyond
in the course of time. Optical technology has many advantages and could
depart radically from the geometries required of "wire"-based systems. An
additional study of optical interconnection is strongly recommended).
The literature on electronic packaging has recently been unified through
publication of an authoritative monographs. This handbook gives a coherent,
balanced discussion of all aspects of electronic packaging and
interconnection, with materials considerations appropriately integrated into
physical design. In addition, the ASM INTERNATIONAL has published a
v
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comprehensive document on packaging, its first that is directed specifically
to electrical and electronic materials3. Concurrently with the preparation of
the present report, a group has been working on a related project sponsored by
the National Security Industrial Association (NSIA). Dr. Bruce E. Kurtz,
chairman of the NSIA Electronics Packaging/Interconnection Task Force, has
kindly provided the committee a draft of this material which was found to be
highly valuable. The materials and processing interaction in packaging is
effectively covered in a recent McGraw-Hill publications.
Anticipating that further advancements in IC technologies would be
hampered by limitations of currently available materials and processes, the
Department of Defense and National Aeronautics and Space Administration
requested the National Materials Advisory Board to examine the situation. A
committee was appointed that included representation from industry,
university, and research institutions and provided a balance of experience and
knowledge in chemistry, polymer science, ceramics, materials science,
electronics, and physics. A biographical sketch for each committee member is
found in Appendix G.
A major objective of this study was to assess the current state of the
art in packaging and to anticipate the requirements for new materials and
processes for packaging highly integrated semiconductor chips and future
designs, particularly for military and space applications. The committee was
asked to assess the existing capability for packaging electronic components
and existing limitations, identify probable needs in new materials and
processing techniques to accommodate new package designs, determine where
superconductor breakthroughs may be properly employed, identify the
electrical, thermal, and mechanical properties of materials needed for the
newly designed chips and interconnects, recommend where R&D efforts should be
directed toward developing the needed materials and systems for future
electronic packages, and, to the extent possible, assess the U.S. position
relative to that of world competition--i.e., Japan, Europe, and others.
Although the report is directed primarily to the sponsoring agencies, it is
presented in a broad-based manner for a wider readership, to help them
understand the current situation and gain a perspective on what actions are
needed to enhance the domestic capability to compete in a global market. A
discussion of nontechnical issues was not in the scope of the committee's
task, however, thoughts on such issues were included to explain why certain
actions are advised to help improve the ir~dustry's competitive position.
lPhotonics: Maintaining Competitiveness in the Information Era. Panel on Science and Technology
Assessment. Washington, D. C.: National Academy Press , 1988 .
Microelectronics Packaging Handbook.
Van Nostrand Reinhold, 1989.
3Electronic Materials Handbook, Vol. 1,
Park, Ohio: ASM INTERNATIONAL, 1989.
4Principles of Electronic Packaging
Che-Yu Li, editors. New York: McGraw-Hill, 1989.
Rao R. Tu~nala and E. J. Rymaszawski, editors . New York:
. Packaging, M. L. Minges, technical chairman. Materials
, Design and Materials Science. D. P. Seraphim, C. Lasky, and
Hi
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ACKNOWLEDGMENTS
The committee is grateful to a number of individuals who provided
extensive background materials for committee use. Experts were invited to
committee meetings to present current data on specific topics of concern. The
following are thanked for their generous participation:
Meeting 1
Meeting 2
R. A. Boudelaise of Westinghouse Defense and Electronics Center
discussed Phase I of MANTECH packaging needs.
J. L. Heaton of Sanders Microelectronics Center discussed MMIC packaging
needs.
M. B. Ketchen of IBM's, T. J. Watson Research Center discussed Josephson
packaging technology.
P. V. McEnroe of Digital Equipment Corporation discussed wafer- scale
integration .
M. C. Peckerar of the U.S. Naval Research Laboratory presented an
overview of VHSIC packaging needs.
R. Smolley of TRW's, Electronics and Technology Division discussed MUSIC
Phase II, advanced development of packaging needs.
R. J. Willis of Floating Point Systems, Inc., discussed packaging of
massive passive parallel systems.
L. E. Cross of Pennsylvania State University discussed inorganic
packaging materials and interconnects.
D. C. Hofer of IBM's, Almaden Research Center discussed organic
packaging materials from a customer's viewpoint.
R. Jensen of Honeywell Sensors and Signal Processing Laboratory
discussed copper-polyimide thin film interconnection technology for T'
p ackaging .
J. Kim of IBM's, T. J. Watson Research Center discussed IBM's thermal
conduction module.
V11
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J. A. Nelson of Unisys Corporation was unable to attend but submitted
comments on packaging materials needs and challenges for large
computers.
R. M. Rivett of Edison Welding Institute discussed microelectronics
metals joining.
R. M. Rosenberg and J. F. Strange of DuPont discussed materials for
packaging and interconnects from a vendor's viewpoint.
Meeting 3
J. E. Anderson of Ford Motor Company discussed materials for electronic
packaging in automotive applications.
J. S. Browning of Sandia National Laboratory discussed radiation effects
in microelectronics.
A. Christou of the U.S. Naval Research Laboratory discussed gallium
arsenide interconnects.
A. Huang of AT&T Bell Laboratories discussed optical digital computers,
the devices and architecture.
A. Husain of Honeywell Sensors and Signal Processing Laboratory
discussed trends in optical interconnect technology.
W. B. Jones of Sandia National Laboratories discussed performance and
metallurgy of aluminum metallization interconnects.
L. M. Levenson of General Electric Company presented the highlights of
the Santa Barbara Engineering Foundation Conference of 1988.
The government liaison representatives are thanked for participating in
committee discussions and providing valuable support materials and data for
committee use. D. R. Franck (President of Empire Planning Group, Ltd.) is
thanked for undertaking an assignment for the committee to provide data on
systems technology proj ections through lS94 . In addition, some specific
industry data in Appendix B are taken from a report, Chip Carriers and Other
Integrated Circus ~ Packages: A Review and Update. 1988, (copyright 1988),
with the kind permission of James D. Welterlen, President of Welterlen, Inc.
These tables illustrate the complexity of the chip encapsulation picture, but
they cover only a fraction of the field covered in Welterlen's annual reports.
The committee is indebted to committee member J. C. Logue, whose years
of packaging experience at IBM was invaluable in its deliberations by
providing technical insight and details for the report. The chairman
acknowledges with thanks the extra efforts of Mr. Logue for his assistance in
coordinating various inputs to the report. The committee members are thanked
for their dedication and for their patience during the lengthy task of
. . .
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preparing and revising the report to ensure its accuracy and currency.
Particular thanks go to the members of the committee who served as chapter or
section coordinators for assembling pertinent facts for various parts of the
report and presenting the data in a timely, open-minded, and professional
manner. Specifically, Paul Penfield and J. C. Logue coordinated Chapter 3, C.
A. Neugebauer coordinated Chapter 4, and Jack Hilibrand contributed heavily to
Chapter 7. Discussions in the report are based on data compiled through
Spring, 1989.
Special thanks are owed to colleagues at AT&T Bell Laboratories in
connection with Chapter 4. D. W. Johnson, L. T. Manzione, and J. M. Segelken
contributed important sections and provided expert advice on packaging issues
generally, and L. L. Blyler, Jr., and L. D. Loan consulted extensively on this
material. M. John Drobny provided the professional renderings for the report
figures. Special thanks go to Shiro Matsuoka for his invaluable assistance as
technical advisor to the committee. Ms. Irene M. Fedun greatly assisted in
coordinating and assembling the preliminary report draft, efforts which are
appreciated by all concerned.
Finally, the committee gratefully acknowledges the untiring support of
George Economos, senior program officer of the National Materials Advisory
Board, and his secretary Ms. Aida Neel, in all stages of report preparation.
David W. McCall
Chairman
1X
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COMMITTEE ON MATERIALS FOR
HIGH-DENSITY ELECTRONIC PACKAGING
Chairman
DAVID W. McCALL, AT&T Bell Laboratories, Murray Hill, New Jersey
Members
GENE M. AMDAHL, Andor Systems, Inc.,
Cupertino, California
DEBORAH D.L. CHUNG, State University of New York, Buffalo
BARRY K. GILBERT, Mayo Clinic, Rochester, Minnesota
JACK HILIBRAND, G. E. Aerospace Company, Philadelphia, Pennsylvania
DONALD C . HOPER, IBM Corporation, San Jose, Cal if ornia
JOSEPH C. LOGUE, Consultant, Poughkeepsie, New York
CONSTANTINE A. NEUGEBAUER, General Electric Company, Schenectady, New York
R. FABIAN W. PEASE, Stanford University, Stanford, California
PAUL PENFIELD, JR.,
Massachusetts
Massachusetts Institute of Technology, Cambridge,
RICHARD L. SCHWOEBEL, Sandia National Laboratories, Albuquerque, New Mexico
BARRY H. WHALEN, Microelectronics & Computer Technology Corporation, Austin,
Texas
Report Coordinator
JOSEPH C. LOGUE' Consultant, Poughkeepsie, New York
Technical Advisor
SHIRO MATSUOKA, AT&T Bell Laboratories, Murray Hill, New Jersey
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Liaison Representatives
ROBERT L. DENISON, Wright-Patterson Air Force Base, Ohio
MARTIN C. PECKERAR, U.S. Naval Research Laboratory, Washington, D.C.
OWEN P. LAYDEN, Department of the Artery,
Ft. Monmouth, New Jersey
MICHAEL A. STROSCIO, Army Research Office, Research Triangle Park, North
Carolina
GEORGE G. HARMAN, National Institute of Standards and Technology,
Gaithersburg, Maryland
JAMES D. MURPHY, Defense Advanced Research Projects Agency, Arlington,
Virginia
JEROME PERSH, The Pentagon, Washington, D.C.
NMAB STAFF
GEORGE ECONOMOS, Senior Program Officer
AIDA NEEL, Senior Secretary
e ~
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CONTENTS
EXECUTIVE SUMMARY 1
Chapter 1 INTRODUCTION 9
Chapter 2 MICROELECTRONIC SYSTEM TRENDS AND PACKAGING NEEDS 21
Scaling Theory 22
Gallium, Arsenide Technology 28
Rent's Rule 29
Chip Technologies 31
Some Package Design Considerations 36
References 38
Chapter 3 PACKAGING STRATEGIES AND ASSOCIATED MATERIALS AND
PROCESS REQUIREMENTS 41
Future Packaging Strategies 45
Packaging Materials, Requirements
Summary of Future Packaging
Materials and Processes Needs
Chapter 4 MATERIALS ISSUES 59
Dissipation of High Thermal Loads
Dielectrical Properties 62
Interconnect Voiding 64
Thermal Fatigue 64
Interfacial Processes
High Temperature Stability and Chemical Reactions
Trace Radionuclides in Packaging Materials 65
Electromagnetic Interference 66
Encapsulants and Hermeticity 66
Materials-Related Reliability Issues 67
Military Packaging 68
References 69
51
60
56
Chapter 5 SOME SPECIFIC MATERIALS 71
The Evolution of Epoxy Materials in Plastic Packaging
Future Trends in Plastic Packaging Materials 73
Organic Printed Circuit Board Materials 76
Processing Technology for Ceramic Packages, Board, and
Substrates 77
. . .
x~t
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Other Ceramic Materials 7 9
Polyimides in High-Density Packaging
Tape Automated Bonding 8 7
Diamond 88
Superconductors
Composites 89
Materials for Very-High-Freguency Digital Systems 91
Materials for Connector Applications 92
The Thermal Conduction Module 92
References 94
88
84
Chapter 6 ORGANIZATIONAL, FUNDING, AND POLICY ISSUES 95
Integration 95
Systems Versus Materials Approaches 97
Programs and Consortia 98
Sematech 99
The Univers ity Role 100
Emigration of Technology 102
Private Funding and Public Funding
Conclus ion 104
Appendix A
Appendix B
Appendix C
Appendix D
Appendix E
Appendix F
Appendix G
103
GLOSSARY OF SOME TERMS AND ACRONYMS USED
IN THE REPORT 105
SOME INDUSTRY COMPONENT DATA 109
MICROPROCESSOR OPERATING AND STRUCTURAL
PARAMETERS 115
EXAMPLES OF DEVELOPMENTS IN BOARD TECHNOLOGIES 119
MATERIALS PROPERTIES 123
EXAMPLES OF lIULTICHIP MODULES 127
BIOGRAPHICAL SKETCHES OF COMMITTEE MEMBERS 135
xiv
