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PAPERBACK price:$19.00 add to cart Rights & Permissions Free PDF Access Sign in to download PDF book and chapters Free Resources PDF SUMMARY Display this book on your site! Related Titles Maximizing U.S. Interests in Science and Technology Relations with Japan Maximizing U.S. Interests in Science and Technology Relations with Japan: Report of the Defense Task Force Other Related Titles U.S.-Japan Strategic Alliances in the Semiconductor Industry: Technology Transfer, Competition, and Public Policy (1992) Office of International Affairs (OIA) Citation Manager Export the bibliographic data for this book in your chosen format Web Search Builder Use this book's key terms to search within this book, across our collection, or across the Web. Skim This Chapter Skim this chapter and use this chapter's key terms to search within this book. Reference Finder Paste in your own text to find books that relate to your topic. Citation Manager . "Appendix C: Examples of Japanese Acquisitions and Investments in U.S. Semiconductor Equipment and Materials Companies." U.S.-Japan Strategic Alliances in the Semiconductor Industry: Technology Transfer, Competition, and Public Policy. Washington, DC: The National Academies Press, 1992. Please select a format: Page 115   E-mail Share on facebook Facebook Share on delicious Delicious Share on stumbleupon Stumble Share on twitter Twitter More Sharing ServicesMore The following HTML text is provided to enhance online readability. Many aspects of typography translate only awkwardly to HTML. Please use the page image as the authoritative form to ensure accuracy. Appendix C Examples of Japanese Acqusitions and Investments in U.S. Semiconductor Equipment and Materials Companies Japanese Investor U.S. Company Year Product/Technology Equity (% or $millions) 1. Advantest Sym-Tek Systems 1988 test equipment   2. Canon AG Associates   semiconductor eqpt. $3m 3. Canon Cymer Laser Technologies 1990 eximer lasers   4. Canon Lepton 1990 masking 49% 5. Dainippon Screen MRS   semiconductor eqpt.   6. Fuji Electric PPC Industries   electron beam   7. Fujikin Carten/Marten 1989 valves   8. Ebara Corp. Varian Associates 1991 cryopump div. $7.5m/Division 9. Hamamatsu Inspex   semiconductor eqpt. 100% 10. Hoya Micromask Inc. 1989 photoplates $25.3/100% 11. Ishikawajima-Harima Heavy Industries Siscan Systems 1990 contamination eqpt. 100% 12. Iwasaki Electric Energy Sciences 1988 electron beam 100% 13. Kobe Steel GCA Laser Inspection   laser inspection 100%/Division 14. Kokusai Elec. BTU International 1992 diffusion furnace $24/Division 15. Komatsu Union Carbide 1990 polysilicon Division 16. Kyocera AVX 1990 ceramic capacitors $575 17. Marubeni Hytech Mattson Technology Inc. 1991 wafer fabrication   18. Mitsubishi Corp. Cymer Laser Technologies 1991 eximer lasers $2 19. Mitsubishi Metals Siltec   silicon wafers 100% 20. Mitsui & Co. Ergenics 1989 vacuum getters   Page 115 Front Matter (R1-R8) 1 Introduction (1-3) 2 Background: Technology Transfer and Latecomer Catch-Up (4-8) 3 Strategic Alliances and Technology Transfer (9-14) 4 Forces Driving the Formation of Strategic Alliances (15-30) 5 A Typology of Alliances (31-50) 6 Issues for U.S. Policy: Japanese Investments and U.S. Competitiveness (51-53) 7 Issues for U.S. Policy: National Security (54-58) 8 Issues for U.S. Policy: Global Technological Stratification and U.S. Technological Capabilities (59-66) 9 Possible Scenarios for U.S.-Japan Alliances and Their Implications for the United States (67-73) 10 Conclusions (74-90) Appendix A: Case Studies of U.S.-Japan Technology Linkages in Semiconductors (91-112) Appendix B: Examples of Japanese Acquisitions and Investments in U.S. Semiconductor Companies (113-114) Appendix C: Examples of Japanese Acquisitions and Investments in U.S. Semiconductor Equipment and Materials Companies (115-116) Appendix D: Workshop on U.S.-Japan Technology Linkages in Semiconductors: Agenda and Participants (117-118)

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U.S.-Japan Strategic Alliances in the Semiconductor Industry: Technology Transfer, Competition, and Public Policy Appendix C Examples of Japanese Acqusitions and Investments in U.S. Semiconductor Equipment and Materials Companies Japanese Investor U.S. Company Year Product/Technology Equity (% or $millions) 1. Advantest Sym-Tek Systems 1988 test equipment   2. Canon AG Associates   semiconductor eqpt. $3m 3. Canon Cymer Laser Technologies 1990 eximer lasers   4. Canon Lepton 1990 masking 49% 5. Dainippon Screen MRS   semiconductor eqpt.   6. Fuji Electric PPC Industries   electron beam   7. Fujikin Carten/Marten 1989 valves   8. Ebara Corp. Varian Associates 1991 cryopump div. $7.5m/Division 9. Hamamatsu Inspex   semiconductor eqpt. 100% 10. Hoya Micromask Inc. 1989 photoplates $25.3/100% 11. Ishikawajima-Harima Heavy Industries Siscan Systems 1990 contamination eqpt. 100% 12. Iwasaki Electric Energy Sciences 1988 electron beam 100% 13. Kobe Steel GCA Laser Inspection   laser inspection 100%/Division 14. Kokusai Elec. BTU International 1992 diffusion furnace $24/Division 15. Komatsu Union Carbide 1990 polysilicon Division 16. Kyocera AVX 1990 ceramic capacitors $575 17. Marubeni Hytech Mattson Technology Inc. 1991 wafer fabrication   18. Mitsubishi Corp. Cymer Laser Technologies 1991 eximer lasers $2 19. Mitsubishi Metals Siltec   silicon wafers 100% 20. Mitsui & Co. Ergenics 1989 vacuum getters  

OCR for page 116
U.S.-Japan Strategic Alliances in the Semiconductor Industry: Technology Transfer, Competition, and Public Policy Japanese Investor U.S. Company Year Product/Technology Equity(% or $millions) 21. Nikon Cymer Laser Technologies   eximer lasers   22. Nippon Gaishi Cabot (Beryllium)   materials Division 23. Nippon Kokan General Electric   silicon factory Division 24. Nippon Mining Gould 1988 copper foil $1,100 25. Nippon Sanso Matheson Gas Products 1989 semiconductor gas 100% 26. Nippon Sanso Semi-Gas Systems 1990 gas handling $23 27. Nippon Sanso Tri Gas Inc. 1992 semiconductor gases $88/100% 28. Nippon Steel Holon       29. Nitto Boseki Midland Bioproducts   semiconductor eqpt.   30. Osaka Titanium Cincinnati Milacron 1989 materials Division 31. Osaka Titanium U.S. Semiconductor   wafers 100% 32. Seki & Co. Novellus Systems 1988 front-end $1.9 33. Shin-Etsu Chem. MicroSi   silicon 100% 34. Sony Corp. Materials Research Corp.   wafer process 100% 35. Sumitomo Corp. LTX Corp.   semiconductor eqpt. 30% 36. Sumitomo Corp. Prometrix 1991 measuring eqpt. $1m 37. Sumitomo Heavy Industries Radiation Dynamics   e-beam.   38. Sumitomo Metals APT   semiconductor eqpt. 5% 39. Sumitomo Metals Lam Research   etching, front-end $5/4.5% 40. Sumitomo Metals LTX Corp. 1990 testing equipment $24m 41. Toray+Shimadzu Therma Wave   semiconductor eqpt. 65% (Toray) 22% (Shimadzu) 42. Toshiba Ceramic Quartz Industrial   materials 80% 43. Tosoh Varian Associates 1989 materials $33m/Division 44. Tosoh Weiss Scientific Glass Blowing 1990 glass for IC fab   45. ULVAC Japan BTU-ULVAC 1991 wafer processing     SOURCE: Compiled by OJA Staff from data provided by the Economic Strategy Institute and the American Electronics Association Japan Office.

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heavy industries