Appendix C
Examples of Japanese Acqusitions and Investments in U.S. Semiconductor Equipment and Materials Companies
Japanese Investor |
U.S. Company |
Year |
Product/Technology |
Equity (% or $millions) |
1. Advantest |
Sym-Tek Systems |
1988 |
test equipment |
|
2. Canon |
AG Associates |
|
semiconductor eqpt. |
$3m |
3. Canon |
Cymer Laser Technologies |
1990 |
eximer lasers |
|
4. Canon |
Lepton |
1990 |
masking |
49% |
5. Dainippon Screen |
MRS |
|
semiconductor eqpt. |
|
6. Fuji Electric |
PPC Industries |
|
electron beam |
|
7. Fujikin |
Carten/Marten |
1989 |
valves |
|
8. Ebara Corp. |
Varian Associates |
1991 |
cryopump div. |
$7.5m/Division |
9. Hamamatsu |
Inspex |
|
semiconductor eqpt. |
100% |
10. Hoya |
Micromask Inc. |
1989 |
photoplates |
$25.3/100% |
11. Ishikawajima-Harima Heavy Industries |
Siscan Systems |
1990 |
contamination eqpt. |
100% |
12. Iwasaki Electric |
Energy Sciences |
1988 |
electron beam |
100% |
13. Kobe Steel |
GCA Laser Inspection |
|
laser inspection |
100%/Division |
14. Kokusai Elec. |
BTU International |
1992 |
diffusion furnace |
$24/Division |
15. Komatsu |
Union Carbide |
1990 |
polysilicon |
Division |
16. Kyocera |
AVX |
1990 |
ceramic capacitors |
$575 |
17. Marubeni Hytech |
Mattson Technology Inc. |
1991 |
wafer fabrication |
|
18. Mitsubishi Corp. |
Cymer Laser Technologies |
1991 |
eximer lasers |
$2 |
19. Mitsubishi Metals |
Siltec |
|
silicon wafers |
100% |
20. Mitsui & Co. |
Ergenics |
1989 |
vacuum getters |
|
Japanese Investor |
U.S. Company |
Year |
Product/Technology |
Equity(% or $millions) |
21. Nikon |
Cymer Laser Technologies |
|
eximer lasers |
|
22. Nippon Gaishi |
Cabot (Beryllium) |
|
materials |
Division |
23. Nippon Kokan |
General Electric |
|
silicon factory |
Division |
24. Nippon Mining |
Gould |
1988 |
copper foil |
$1,100 |
25. Nippon Sanso |
Matheson Gas Products |
1989 |
semiconductor gas |
100% |
26. Nippon Sanso |
Semi-Gas Systems |
1990 |
gas handling |
$23 |
27. Nippon Sanso |
Tri Gas Inc. |
1992 |
semiconductor gases |
$88/100% |
28. Nippon Steel |
Holon |
|
|
|
29. Nitto Boseki |
Midland Bioproducts |
|
semiconductor eqpt. |
|
30. Osaka Titanium |
Cincinnati Milacron |
1989 |
materials |
Division |
31. Osaka Titanium |
U.S. Semiconductor |
|
wafers |
100% |
32. Seki & Co. |
Novellus Systems |
1988 |
front-end |
$1.9 |
33. Shin-Etsu Chem. |
MicroSi |
|
silicon |
100% |
34. Sony Corp. |
Materials Research Corp. |
|
wafer process |
100% |
35. Sumitomo Corp. |
LTX Corp. |
|
semiconductor eqpt. |
30% |
36. Sumitomo Corp. |
Prometrix |
1991 |
measuring eqpt. |
$1m |
37. Sumitomo Heavy Industries |
Radiation Dynamics |
|
e-beam. |
|
38. Sumitomo Metals |
APT |
|
semiconductor eqpt. |
5% |
39. Sumitomo Metals |
Lam Research |
|
etching, front-end |
$5/4.5% |
40. Sumitomo Metals |
LTX Corp. |
1990 |
testing equipment |
$24m |
41. Toray+Shimadzu |
Therma Wave |
|
semiconductor eqpt. |
65% (Toray) 22% (Shimadzu) |
42. Toshiba Ceramic |
Quartz Industrial |
|
materials |
80% |
43. Tosoh |
Varian Associates |
1989 |
materials |
$33m/Division |
44. Tosoh |
Weiss Scientific Glass Blowing |
1990 |
glass for IC fab |
|
45. ULVAC Japan |
BTU-ULVAC |
1991 |
wafer processing |
|
SOURCE: Compiled by OJA Staff from data provided by the Economic Strategy Institute and the American Electronics Association Japan Office. |