Japanese Investor

U.S. Company

Year

Product/Technology

Equity(% or $millions)

21. Nikon

Cymer Laser Technologies

 

eximer lasers

 

22. Nippon Gaishi

Cabot (Beryllium)

 

materials

Division

23. Nippon Kokan

General Electric

 

silicon factory

Division

24. Nippon Mining

Gould

1988

copper foil

$1,100

25. Nippon Sanso

Matheson Gas Products

1989

semiconductor gas

100%

26. Nippon Sanso

Semi-Gas Systems

1990

gas handling

$23

27. Nippon Sanso

Tri Gas Inc.

1992

semiconductor gases

$88/100%

28. Nippon Steel

Holon

 

 

 

29. Nitto Boseki

Midland Bioproducts

 

semiconductor eqpt.

 

30. Osaka Titanium

Cincinnati Milacron

1989

materials

Division

31. Osaka Titanium

U.S. Semiconductor

 

wafers

100%

32. Seki & Co.

Novellus Systems

1988

front-end

$1.9

33. Shin-Etsu Chem.

MicroSi

 

silicon

100%

34. Sony Corp.

Materials Research Corp.

 

wafer process

100%

35. Sumitomo Corp.

LTX Corp.

 

semiconductor eqpt.

30%

36. Sumitomo Corp.

Prometrix

1991

measuring eqpt.

$1m

37. Sumitomo Heavy Industries

Radiation Dynamics

 

e-beam.

 

38. Sumitomo Metals

APT

 

semiconductor eqpt.

5%

39. Sumitomo Metals

Lam Research

 

etching, front-end

$5/4.5%

40. Sumitomo Metals

LTX Corp.

1990

testing equipment

$24m

41. Toray+Shimadzu

Therma Wave

 

semiconductor eqpt.

65% (Toray) 22% (Shimadzu)

42. Toshiba Ceramic

Quartz Industrial

 

materials

80%

43. Tosoh

Varian Associates

1989

materials

$33m/Division

44. Tosoh

Weiss Scientific Glass Blowing

1990

glass for IC fab

 

45. ULVAC Japan

BTU-ULVAC

1991

wafer processing

 

 

SOURCE: Compiled by OJA Staff from data provided by the Economic Strategy Institute and the American Electronics Association Japan Office.



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