Appendix A: Forum Agenda
May 4, 1993
Session I: Welcome and Keynote Address
0830 |
Welcome and Introduction |
Robert M. White, Vice Chair, NRC Jim Williams, Chair, NMAB, and David Litster, Chair, SSSC |
0845 |
Keynote Address: New Forms of Cooperation and the Impact on Competitiveness |
Senator Jeff Bingaman (D-New Mexico) |
0915 |
Questions from the Audience |
Session II: Perspectives on the AMPP from the Federal Agencies
0930 |
Advanced Materials and Processing: The Federal Program in Materials Science and Technology |
Lyle Schwartz, Director, Materials Science and Engineering Laboratory, NIST, and Chair, COMAT |
1000 |
National Science Foundation |
William Harris, Assistant Director for Mathematical and Physical Sciences |
1030 |
Department of Energy |
Will Happer, Director, Office of Energy Research |
1100 |
Advanced Research Projects Agency |
Gary Denman, Director |
1130 |
National Aeronautics and Space Administration |
Daniel Goldin, Administrator |
1200 |
Panel Discussion |
Above plus Bill Appleton, Praveen Chaudhari, Henry Ehrenreich, Merton Flemings, Bob Laudise, David Litster, John Poate, and Jim Williams |
1230 |
Questions from the Audience |
|
1300 |
Lunch |
Session III: Integration of Science, Engineering, and Societal Needs in Materials
1430 |
National Laboratories: Their Role in U.S. Economic Security |
Al Narath, Sandia National Laboratories |
1515 |
Government Technology Policy: What Should It Do? |
Don E. Kash, George Mason University |
1545 |
Break |
|
1600 |
The Role of Consortia in U.S. Industrial Competitiveness |
Craig Fields, MCC |
1630 |
Discussion and Closing Remarks |
Jim Williams and David Litster |
1700 |
Reception |
May 5, 1993
Session IV: Challenges for Materials in the 21st Century
0845 |
Welcome and Introduction |
Jim Williams, Chair, NMAB; David Litster, Chair, SSSC; and John Poate, Washington Materials Forum |
0900 |
Motorola: Cooperative Efforts in Microelectronics in the United States |
Tommy George, Motorola |
0930 |
IBM: The Technology Value Chain: Evolution and Implications |
Jim McGroddy, IBM |
1000 |
AT&T Bell Laboratories: The Changing Role of Industrial Research |
William Brinkman, AT&T |
1030 |
Break |
|
1100 |
Boeing: Engineering Needs in Structural Materials |
Don Lovell, Boeing |
1130 |
General Electric: High-Strength Light-weight Materials for Transportation |
Jim Williams, GE |
1200 |
Hewlett Packard: Emerging Technologies in the U.S. Optoelectronics Industry |
Roland Haitz, Hewlett Packard |
1230 |
Lunch |
Session V: Challenges for Materials in the 21st Century (cont.)
1400 |
Technology Transfer Activities in Government Laboratories |
Panel: Bill Appleton, ORNL; Dan Arvizu, Sandia; Roger Lewis, DOE |
1445 |
The Changing Climate for Precompetitive R&D Collaboration |
John P. McTague, Ford Motor Co. |
1515 |
Break |
|
1530 |
University Research in Tomorrow's Environment |
Venkatesh Narayanamurti, UC Santa Barbara |
1600 |
Engineering Education in the 21st Century |
Raymond Orbach, UC Riverside |
1630 |
Discussion and Closing Remarks |
Jim Williams, David Litster, and John Poate |
1700 |
Adjourn |