An Assessment of the National Institute of Standards and Technology Programs: Fiscal Year 1997 (1997)

AASHTO—

American Association of State Highway and Transportation Officials

ACSL—

Advanced Chemical Sciences Laboratory

AES—

Auger electron spectroscopy

ALARA—

as low as reasonably achievable

ANSI—

American National Standards Institute

API—

application program interface

ASTM—

American Society for Testing and Materials

ATM—

asynchronous transfer mode

ATP—

Advanced Technology Program

BACnet—

Building Automation and Controls Network

BFRL—

Building and Fire Research Laboratory

BIPM—

Consultative Committees of the International Bureau of Weights and Measures

BLAS—

Basic Linear Algebra Subprograms

CAM—

computer-aided manufacturing

CARB—

Center for Advanced Research in Biotechnology

CCT—

Consultative Committee on Thermometry

CFCs—

chlorofluorocarbons

CFD—

computational fluid dynamics

CHRNS—

Center for High Resolution Neutron Scattering

CICE—

computer-integrated construction environment(s)

CIKS—

Computer-Integrated Knowledge System(s)

CIRMS—

Council on Ionizing Radiation Measurements and Standards

CKMech—

Chemical Kinetic Mechanisms

CMM—

coordinate measuring machine

CMOS—

complementary metal oxide semiconductor

CNC—

computer numerical control

CNRF—

Cold Neutron Research Facility

CONMAT—

Construction Materials and Systems Council

CONTAM—

a multizone indoor air-quality model designed to track airflow and contaminant dispersal

CRADAs—

Cooperative Research and Development Agreements

CRDS—

cavity ring-down spectroscopy

Cryo-TEM—

cryogenic transmission electron microscopy

CSCS—

Consolidated Scientific Computing Systems

CSTL—

Chemical Science and Technology Laboratory

CTCMS—

Center for Theoretical and Computational Materials Science

DAVIC—

Digital Audio Visual Council

DoE—

Department of Energy

EBIT—

Electron Beam Ion Trap

EC—

European Community

EEEL—

Electronics and Electrical Engineering Laboratory

EIS—

Environmental Impact Statement

EMC—

electromagnetic compatibility

EMC—

enhanced machine controller

EMF—

electromagnetic field

EMI—

electromagnetic interference

EPA—

Environmental Protection Agency

ESD—

electrostatic discharge

FDA—

Food and Drug Administration

FET—

field-effect transistor

FHWA—

Federal Highway Administration

FIB—

focused ion beam

FIR—

far-infrared

FTIR—

Fourier transform infrared

FTP—

full-time permanent

GC/AED—

gas chromatography/atomic emission detector

GC/MS—

gas chromatography/mass spectrometry

GMR—

giant magnetoresistance

HCFCs—

hydrochlorofluorocarbons

HELP—

high-dimensional empirical linear prediction

HEMTS—

high-electron-mobility transistors

HFC—

hybrid fiber/coaxial

HPCC—

high-performance computing and communication (systems)

HVAC—

heating, ventilation, and air conditioning

IAQ—

indoor air quality

IAT—

International Atomic Time

ICP—

inductively coupled plasma

IEEE—

Institute of Electrical and Electronics Engineers

IETF—

Internet Engineering Task Force

IGBT—

insulated-gate bipolar transistor

IMPACT—

a set of guidelines designed to assist building owners, operators, and designers in evaluating the mpact of building materials on IAQ

IMPI—

interoperability message passage interface

IMTC—

International Multimedia Teleconferencing Consortium

IPS—

Internet Protocol Suite

ISO—

International Organization for Standardization

ITS—

Industrial Technology Services (ATP and MEP)

ITS—

International Temperature Scale of 1990

IUPAC—

International Union of Pure and Applied Chemistry

LC—

liquid chromatography

LCC—

life-cycle costs

M³—

Molecular Measuring Machine

MAC—

medium access control

MALDI—

matrix-assisted laser desorption ionization

MBE—

molecular beam epitaxy

MEL—

Manufacturing Engineering Laboratory

MEMS—

micro-electromechanical systems

MEP—

Manufacturing Engineering Program

MIRF—

Medical-Industrial Radiation Facility

MMIC—

microwave monolithic integrated circuit

MOIST—

moisture flow analysis software

MPEG—

Motion Pictures Expert Group

MPI—

message passing interface

MS—

mass spectrometry

MSEL—

Materials Science and Engineering Laboratory

NAMT—

National Advanced Manufacturing Testbed

NC—

numerically controlled

NDP—

neutron depth profiling

NEMI—

National Electronics Manufacturing Initiative

NF—

nonfederal

NGIS—

Next Generation Inspection System

NIR—

near-infrared

NMR—

nuclear magnetic resonance

NOAA—

National Oceanic and Atmospheric Administration

NSA—

National Security Agency

NSF—

National Science Foundation

NSIC—

National Storage Industry Consortium

NSMP—

National Semiconductor Metrology Program

NSOM—

near-field scanning optical microscopy

NSTL—

National Software Testing Laboratory

NTRM—

NIST Traceable Reference Materials

NTRS—

National Technology Roadmap for Semiconductors

OA—

other agency

OAE—

Office of Applied Economics

OIDA—

Optoelectronics Industry Development Association

OLES—

Office of Law Enforcement Standards

OMAC—

Open, Modular Architecture Controller

OMP—

Office of Microelectronics Programs

OSI—

open systems interconnection

PGAA—

prompt gamma activation analysis

PKI—

public key infrastructures

RBAC—

role-based access control

RTC—

Real-time Control (System)

SAC—

Safety Audit Committee

SANS—

small-angle neutron scattering

SAR—

Safety Analysis Report

SAXS—

small-angle x-ray scattering

SEM—

scanning electron microscopy

SEMATECH—

Semiconductor Manufacturing Technology

SEMPA—

Scanning Electron Microscopy with Polarization Analysis

SET—

single-electron tunneling

SHMOKE—

second harmonic magneto-optic Keer effect

SI—

International System of Units

SIMS—

secondary ion-mass spectrometry

SIP—

STEP Implementation Prototypes

SPINS—

Spin-Polarized Inelastic Neutron Scattering

SQL—

Structured Query Language

SRD—

Standard Reference Data

SRMs—

Standard Reference Materials

STEP—

standard for exchange of product data

STRS—

Scientific and Technical Research and Services

SURF—

Synchrotron Ultraviolet Radiation Facility

TAI—

international atomic time

TEAM—

Technologies Enabling Agile Manufacturing

TEM—

transmission electron microscopy

TIA—

Telecommunications Industries Association

TIMS—

thermal ionization mass spectrometry

UTC—

coordinated universal time

VCSEL—

vertical-cavity surface-emitting laser

VRML—

Virtual Reality Modeling Language

VUV—

vacuum ultraviolet

XPS—

x-ray photoelectron spectroscopy

XUV—

extreme ultraviolet