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An Assessment of the NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY PROGRAMS: Fiscal Year 1997 Appendix D Glossary of Acronyms and Abbreviations AASHTO— American Association of State Highway and Transportation Officials ACSL— Advanced Chemical Sciences Laboratory AES— Auger electron spectroscopy ALARA— as low as reasonably achievable ANSI— American National Standards Institute API— application program interface ASTM— American Society for Testing and Materials ATM— asynchronous transfer mode ATP— Advanced Technology Program BACnet— Building Automation and Controls Network BFRL— Building and Fire Research Laboratory BIPM— Consultative Committees of the International Bureau of Weights and Measures BLAS— Basic Linear Algebra Subprograms CAM— computer-aided manufacturing CARB— Center for Advanced Research in Biotechnology CCT— Consultative Committee on Thermometry CFCs— chlorofluorocarbons CFD— computational fluid dynamics CHRNS— Center for High Resolution Neutron Scattering CICE— computer-integrated construction environment(s) CIKS— Computer-Integrated Knowledge System(s) CIRMS— Council on Ionizing Radiation Measurements and Standards CKMech— Chemical Kinetic Mechanisms CMM— coordinate measuring machine CMOS— complementary metal oxide semiconductor CNC— computer numerical control CNRF— Cold Neutron Research Facility CONMAT— Construction Materials and Systems Council CONTAM— a multizone indoor air-quality model designed to track airflow and contaminant dispersal CRADAs— Cooperative Research and Development Agreements CRDS— cavity ring-down spectroscopy Cryo-TEM— cryogenic transmission electron microscopy CSCS— Consolidated Scientific Computing Systems CSTL— Chemical Science and Technology Laboratory
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An Assessment of the NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY PROGRAMS: Fiscal Year 1997 CTCMS— Center for Theoretical and Computational Materials Science DAVIC— Digital Audio Visual Council DoE— Department of Energy EBIT— Electron Beam Ion Trap EC— European Community EEEL— Electronics and Electrical Engineering Laboratory EIS— Environmental Impact Statement EMC— electromagnetic compatibility EMC— enhanced machine controller EMF— electromagnetic field EMI— electromagnetic interference EPA— Environmental Protection Agency ESD— electrostatic discharge FDA— Food and Drug Administration FET— field-effect transistor FHWA— Federal Highway Administration FIB— focused ion beam FIR— far-infrared FTIR— Fourier transform infrared FTP— full-time permanent GC/AED— gas chromatography/atomic emission detector GC/MS— gas chromatography/mass spectrometry GMR— giant magnetoresistance HCFCs— hydrochlorofluorocarbons HELP— high-dimensional empirical linear prediction HEMTS— high-electron-mobility transistors HFC— hybrid fiber/coaxial HPCC— high-performance computing and communication (systems) HVAC— heating, ventilation, and air conditioning IAQ— indoor air quality IAT— International Atomic Time ICP— inductively coupled plasma IEEE— Institute of Electrical and Electronics Engineers IETF— Internet Engineering Task Force IGBT— insulated-gate bipolar transistor IMPACT— a set of guidelines designed to assist building owners, operators, and designers in evaluating the mpact of building materials on IAQ IMPI— interoperability message passage interface IMTC— International Multimedia Teleconferencing Consortium IPS— Internet Protocol Suite ISO— International Organization for Standardization ITS— Industrial Technology Services (ATP and MEP) ITS— International Temperature Scale of 1990 IUPAC— International Union of Pure and Applied Chemistry
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An Assessment of the NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY PROGRAMS: Fiscal Year 1997 LC— liquid chromatography LCC— life-cycle costs M³— Molecular Measuring Machine MAC— medium access control MALDI— matrix-assisted laser desorption ionization MBE— molecular beam epitaxy MEL— Manufacturing Engineering Laboratory MEMS— micro-electromechanical systems MEP— Manufacturing Engineering Program MIRF— Medical-Industrial Radiation Facility MMIC— microwave monolithic integrated circuit MOIST— moisture flow analysis software MPEG— Motion Pictures Expert Group MPI— message passing interface MS— mass spectrometry MSEL— Materials Science and Engineering Laboratory NAMT— National Advanced Manufacturing Testbed NC— numerically controlled NDP— neutron depth profiling NEMI— National Electronics Manufacturing Initiative NF— nonfederal NGIS— Next Generation Inspection System NIR— near-infrared NMR— nuclear magnetic resonance NOAA— National Oceanic and Atmospheric Administration NSA— National Security Agency NSF— National Science Foundation NSIC— National Storage Industry Consortium NSMP— National Semiconductor Metrology Program NSOM— near-field scanning optical microscopy NSTL— National Software Testing Laboratory NTRM— NIST Traceable Reference Materials NTRS— National Technology Roadmap for Semiconductors OA— other agency OAE— Office of Applied Economics OIDA— Optoelectronics Industry Development Association OLES— Office of Law Enforcement Standards OMAC— Open, Modular Architecture Controller OMP— Office of Microelectronics Programs OSI— open systems interconnection PGAA— prompt gamma activation analysis PKI— public key infrastructures RBAC— role-based access control RTC— Real-time Control (System)
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An Assessment of the NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY PROGRAMS: Fiscal Year 1997 SAC— Safety Audit Committee SANS— small-angle neutron scattering SAR— Safety Analysis Report SAXS— small-angle x-ray scattering SEM— scanning electron microscopy SEMATECH— Semiconductor Manufacturing Technology SEMPA— Scanning Electron Microscopy with Polarization Analysis SET— single-electron tunneling SHMOKE— second harmonic magneto-optic Keer effect SI— International System of Units SIMS— secondary ion-mass spectrometry SIP— STEP Implementation Prototypes SPINS— Spin-Polarized Inelastic Neutron Scattering SQL— Structured Query Language SRD— Standard Reference Data SRMs— Standard Reference Materials STEP— standard for exchange of product data STRS— Scientific and Technical Research and Services SURF— Synchrotron Ultraviolet Radiation Facility TAI— international atomic time TEAM— Technologies Enabling Agile Manufacturing TEM— transmission electron microscopy TIA— Telecommunications Industries Association TIMS— thermal ionization mass spectrometry UTC— coordinated universal time VCSEL— vertical-cavity surface-emitting laser VRML— Virtual Reality Modeling Language VUV— vacuum ultraviolet XPS— x-ray photoelectron spectroscopy XUV— extreme ultraviolet
Representative terms from entire chapter: