Appendix A
Participants
W. Wade Adams, Materials Directorate/Wright Laboratory, Wright-Patterson Air Force Base, Dayton, Ohio
Jane Alexander, Advanced Research Projects Agency, Arlington, Virginia
John Baglin, IBM Research Center, San Jose, California
Michael Baskes, Sandia National Laboratories, Livermore, California
Ben Bederson, American Physical Society, New York, New York
James Callan, University of Massachusetts, Amherst, Massachusetts
Carl Cargill, Sun Microsystems, Mountain View, California
Edward Chen, U.S. Army Research Office, Research Triangle Park, North Carolina
Kristen Constant, Iowa State University, Ames, Iowa
James Coleman, DuPont Central Research and Development, Wilmington, Delaware
Frank W. Crossman, Materials Technologies, Advanced Technology Center, Lockheed Martin Missiles and Space, Palo Alto, California
Lance Davis, Defense Research & Engineering, U.S. Department of Defense, Washington, D.C.
Larry Davis, User Technology Associates, Arlington, Virginia
James Davis, Research Staff, Xerox Corporation, New York
Robert Dutton, Stanford University, Stanford, California
Joseph Friday, Aluminum Company of America Technical Center, Alcoa, Pennsylvania
Peter Goldie, Lightbinders, Inc., San Francisco, California
Donald Gubser, Naval Research Laboratories, Washington, D.C.
Charles Hach, National Materials Advisory Board, National Research Council, Washington, .C.
Alan J. Hurd, Ceramics Processing Science, Sandia National Laboratories, Albuquerque, New Mexico
Lawrence Kabacoff, Office of Naval Research, Arlington, Virginia
Nirav Kapadia, Purdue University, Lafayette, Indiana
Lawrence Kerschberg, Department of Information and Software Engineering, George Mason University, Fairfax, Virginia
W. Douglas Knowles, Information Systems, ASM International, Materials Park, Ohio
Robert Laudise, Bell Laboratories, Lucent Technologies, Murray Hill, New Jersey
Steve LeClair, Wright Laboratory, Wright-Patterson Air Force Base, Dayton, Ohio
Stu Loken, Lawrence Berkeley National Laboratory, Berkeley, California
Paul Losleben, Stanford University, Stanford, California
Mark Lundstrom, Purdue University, Lafayette, Indiana
Kim Mahin, Sandia National Laboratories, Albuquerque, New Mexico
David Maluf, Stanford University, Stanford, California
Louis T. Manzione, Bell Laboratories, Lucent Technologies, Murray Hill, New Jersey
John Mitchiner, Sandia National Laboratories, Albuquerque, New Mexico
Mark Munson, Information Systems, Minerals, Metals, and Materials Society, Warrendale, Pennsylvania
Hari Narayanan, Boeing Commercial Airplane Group, Seattle, Washington
Ruth Pachter, Materials Directorate, Wright Laboratory, Wright-Patterson Air Force Base, Dayton, Ohio
Bahram Parvin, Information and Computer Science Division, Lawrence Berkeley National Laboratory, Berkeley, California
Calton Pu, Department of Computer Science and Engineering, Oregon Graduate Institute of Science and Technology, Portland, Oregon
Kenneth Reifsnider, Virginia Polytechnic Institute, Blacksburg, Virginia
Thomas Rohmiller, Wright Laboratory, Wright-Patterson Air Force Base, Ohio
Alton Romig, Electronic Materials Center, Sandia National Laboratories, Albuquerque, New Mexico
John Rumble, National Institute of Standards and Technology, Gaithersburg, Maryland
Robert Rusnak, National Materials Advisory Board, National Research Council, Washington, D.C.
Leslie Schneider, Manufacturing Research Center and TECnet, Tufts University, Medford, Massachusetts
Michael Schwartz, @Home Network, Mountain View, California
Kevin Skinner, Tech Connect, Wright-Patterson Air Force Base, Ohio
John Smugeresky, Sandia National Laboratories, Livermore, California
Nishikant Sonwalkar, Hypermedia Teaching Facility, Massachusetts Institute of Technology, Cambridge, Massachusetts
Ram Sriram, AI Center, Advanced Technology Center, Lockheed Martin, Palo Alto, California
John Weaver, University of Minnesota, Minneapolis, Minnesota
Gio Wiederhold, Stanford University, Stanford, California
David Williams, Lehigh University, Bethlehem, Pennsylvania
Jerry Woodall, Purdue University, Lafayette, Indiana
