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Procedure—Target
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Techinique—Problems
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Dry heat—exterior/interior
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105-180 °C for 1 to 300 hours—Problems caused by thermomechanical incompatibility between materials can lead to the faliure of electronic components.
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Wet heat—exterior/interior
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120-134 °C for 3 to 20 minutes—Problems can be caused by steam (e.g., corrosion and water absorption).
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Alcohol wipes—exterior surfaces
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Isopropyl or ethyl alcohol swabbing—Problems arise because interior and encased surfaces (e.g., electronic components) are inaccessible.
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Ethylene dioxide—exterior/internal exposed surfaces
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Toxic gas, 40 to 70 °C—Problems arise because the gas can only reach exposed surfaces and because it is absorbed by some types of polymers (e.g., rubbers and polyvinyl chloride).
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Gamma radiation—exterior/subsurface
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Typically, 2.5 Mrad—Problems encountered include optical changes in glasses and damage to electronics and solar cells.
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Beta radiation—exterior/near-surface
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1 to 10 MeV—Problems arise because of limited penetration.
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Hydrogen peroxide plasma—exterior/internal exposed surfaces
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6 mg/l H202 concentrated at 58%—Problems can be encountered because the unexposed surfaces remain untreated.
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Ultraviolet—exterior surfaces
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5,000 to 20,000 J/m2—Problems arise because unexposed surfaces remain untreated.
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Methyl bromide—exterior/internal exposed surfaces
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Toxic gas—Problems can be encountered because unexposed surfaces remain untreated and because the gas catalyzes chemical reactions between metal and other components.
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