Read more than 3,700 books online FREE! More than 1900 PDFs now available for sale

HOME

ABOUT NAP

CONTACT NAP

HELP

NEW RELEASES

ORDERING INFO

Questions? Call 888-624-8373

Items in cart [0]

Materials for High-Temperature Semiconductor Devices

Book Cover

Status: Available Now

Size: 136 pages, 8.5 x 11

Publication Year:1995

Print	List Price	Your Price

PAPERBACK ISBN-10: 0-309-05335-8 ISBN-13: 978-0-309-05335-8	$34.00	$30.60	Add to Cart

PDF		Your Price
PDF Download [1.7 MB]		$26.50	Add to Cart
PDF? What am I buying?

Authors:
Committee on Materials for High-Temperature Semiconductor Devices, Commission on Engineering and Technical Systems, National Research Council
Authoring Organizations

Description:
Major benefits to system architecture would result if cooling systems for components could be eliminated without compromising performance. This book surveys the state-of-the-art for the three major wide bandgap materials (silicon carbide, nitrides, and diamond), assesses the national and international ...
Read More

Paste into your Web page:

<!-- Start NAP Book Display -->
<table style="BORDER-RIGHT: black 1px solid; PADDING-RIGHT: 0px; BORDER-TOP: black 1px solid; PADDING-LEFT: 0px; PADDING-BOTTOM: 0px; MARGIN: 0px; BORDER-LEFT: black 1px solid; WIDTH: 158px; PADDING-TOP: 0px; BORDER-BOTTOM: black 1px solid; HEIGHT: 200px; line-height: 10px; background-color: #ffffff;" cellspacing="0" cellpadding="0" width="158" border="0" height="200">
<tbody><tr><td style="PADDING-RIGHT: 0px; PADDING-LEFT: 0px; PADDING-BOTTOM: 0px; MARGIN: 0px; WIDTH: 129px; PADDING-TOP: 0px; HEIGHT: 38px;" valign="top" align="right" width="129" colspan="2" height="38"><img style="VERTICAL-ALIGN: top; WIDTH: 129px; HEIGHT: 38px; border: none; margin: 0; padding: 0;" height="38" alt="" src="http://images.nap.edu/images/widgetdisplay_nap1.gif" width="129" height="38" alt="" border="0" align="top"></td><td style="VERTICAL-ALIGN: top; WIDTH: 29px; BACKGROUND-COLOR: #990000; padding: 0; margin: 0;" valign="top" align="left" width="29" bgcolor="#990000" rowspan="4"><img height="200" alt="" src="http://images.nap.edu/images/widgetdisplay_nap2.gif" width="29" valign="top" style="VERTICAL-ALIGN: top; WIDTH: 29px; border: none; margin: 0; padding: 0;" /></td></tr><tr><td valign="top" width="130" style="width: 130px; padding: 0; margin: 0; vertical-align: top; text-align: center; height: 50px;"><div style="PADDING-RIGHT: 5px; PADDING-LEFT: 0px; PADDING-BOTTOM: 10px; WIDTH: 115px; PADDING-TOP: 2px; HEIGHT: 50px; VERTICAL-ALIGN: top; margin: 0; "><!-- insert book title --><a style="PADDING-RIGHT: 0px; PADDING-LEFT: 0px; PADDING-BOTTOM: 0px; MARGIN: 0px; FONT: 11/13px arial; COLOR: #990000; PADDING-TOP: 0px; text-decoration: underline;" href="http://www.nap.edu/catalog.php?record_id=5023&utm_source=Network&utm_medium=Widgetv2&utm_content=v2&utm_campaign=Widget" target="_blank">Materials for High-Temperature Semiconductor Devices ...</a></div></td></tr><tr><td align="middle" width="130"><!-- insert tinycov image --><img style="BORDER-RIGHT: #000 1px solid; BORDER-TOP: #000 1px solid; BORDER-LEFT: #000 1px solid; BORDER-BOTTOM: #000 1px solid; padding: 0; margin: 0" alt="" src="http://images.nap.edu/images/cover.php?id=5023&type=tinycov" width="70" /></td></tr><tr><td style="PADDING-RIGHT: 2px; PADDING-LEFT: 2px; PADDING-BOTTOM: 2px; PADDING-TOP: 2px" valign="top" align="middle"><span style="PADDING-RIGHT: 0px; PADDING-LEFT: 0px; PADDING-BOTTOM: 0px; MARGIN: 0px; FONT: 11px arial; PADDING-TOP: 0pxcolor:#000000;" >Read this FREE online!<br><a style="PADDING-RIGHT: 0px; PADDING-LEFT: 0px; PADDING-BOTTOM: 0px; MARGIN: 0px; FONT: 9px arial; COLOR: #990000; PADDING-TOP: 0px; text-decoration: underline;" href="http://www.nap.edu/openbook.php?record_id=5023&utm_source=Network&utm_medium=Widgetv2&utm_content=v2&utm_campaign=Widget">Full Book</a> | <a style="PADDING-RIGHT: 0px; PADDING-LEFT: 0px; PADDING-BOTTOM: 0px; MARGIN: 0px; FONT: 9px arial; COLOR: #990000; PADDING-TOP: 0px; text-decoration: underline;" href="http://www.nap.edu/nap-cgi/execsumm.cgi?record_id=5023&utm_source=Network&utm_medium=Widgetv2&utm_content=v2&utm_campaign=Widget">PDF Summary</a></span></td></tr></tbody></table>	<!-- End NAP Book Display -->

Free Resources

Full Text
Jump to this book's table of contents to begin reading online for free.

Related Items:
Related Titles

Web Search Builder
Use this book's key terms to search within this book, across our collection, or across the Web.

Reference Finder
Paste in your own text to find books that relate to your topic.

PDF Summary
Download executive summary in PDF.

Reprint Permission
Request permission to license or reprint the book's content through Copyright Clearance Center's Rightslink.

Request Permission to Distribute a PDF

Request Translation Rights

Questions About Rights and Permissions?

Table of Contents
Select a link below to start reading online free!
Front Matter	i-xvi
Executive Summary	1-6	(skim)
Backgorund	7-14	(skim)
State of the Art of Wide Bandgap Materials	15-30	(skim)
Device Physics: Behavior at Elevated Temperatures	31-38	(skim)
Generic Technical Issues Associated with Materials for High-Temperatures...	39-50	(skim)
High-Temperature Electronic Packaging	51-60	(skim)
Device Testing for High-Temperature Electronic Materials	61-64	(skim)
Conclusions and Recommendations	65-70	(skim)
References	71-80	(skim)
Appendix A: Silicon as a High-Temperature Material	81-86	(skim)
Appendix B: Gallium Arsenide as a High Temperature Material	87-92	(skim)
Appendix C: High-Temperature Microwave Devices	93-118	(skim)
Appendix D: Biographical Sketches of Committee Members	119-120	(skim)

Description

Major benefits to system architecture would result if cooling systems for components could be eliminated without compromising performance. This book surveys the state-of-the-art for the three major wide bandgap materials (silicon carbide, nitrides, and diamond), assesses the national and international efforts to develop these materials, identifies the technical barriers to their development and manufacture, determines the criteria for successfully packaging and integrating these devices into existing systems, and recommends future research priorities.

Authoring Organizations

About the PDF: What am I Buying?

About Our PDFs

This book can be purchased as a computer file. The format of the file is called a "PDF". To open, view and print the file, you must have third party software (e.g. Adobe Reader or XPDF) installed on your computer.

Benefits of Buying a PDF

Instant. Buy it, download it immediately, and start reading.
Convenient. Download it to your laptop and read it whenever, wherever.
Searchable. Search for any word or phrase.

What are my options?

If you want ...	Then ...
... a computer file containing the entire book	... buy a PDF
... to read the book immediately and also own a copy for your bookshelf	... buy the bundle
... a copy for your bookshelf	... buy the book

Will my PDF be emailed to me?

No. After buying the PDF, we will email you instructions on how to download the file from our Web site. The PDF file will not be emailed to you.

See our Frequently Asked Questions for more information including:

Search This Book

»Find more like this book

SIGN UP FOR...

New Title Emails
Read about the newest releases and receive special offers.

[ Top of Page ] [ Home ] [ Contact Us ] [ Help ] [ The National Academies Home ]
Copyright © 2008. National Academy of Sciences. All rights reserved. 500 Fifth St. N.W., Washington, D.C. 20001. Terms of Use and Privacy Statement