TY - BOOK AU - National Research Council TI - Materials for High-Density Electronic Packaging and Interconnection SN - 978-0-309-04233-8 DO - 10.17226/1624 PY - 1990 UR - https://nap.nationalacademies.org/catalog/1624/materials-for-high-density-electronic-packaging-and-interconnection PB - The National Academies Press CY - Washington, DC LA - English KW - Engineering and Technology ER -