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Suggested Citation:"Appendix D: Acronyms." National Academies of Sciences, Engineering, and Medicine. 2019. High-Entropy Materials, Ultra-Strong Molecules, and Nanoelectronics: Emerging Capabilities and Research Objectives: Proceedings of a Workshop. Washington, DC: The National Academies Press. doi: 10.17226/25106.
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D

Acronyms

1D one-dimensional
2D two-dimensional
3D three-dimensional
AFM atomic force microscopy
AIMD ab initio molecular dynamic
ALD atomic-layer deposition
BCC body-centered cubic
CALPHAD Computer Coupling of Phase Diagrams and Thermochemistry
CCA complex concentrated alloy
CMOS complementary metal-oxide-semiconductor
COI community of interest
CVD chemical vapor deposition
DFT density functional theory
DMMI Defense Materials Manufacturing and Infrastructure
DoD Department of Defense
DOE Department of Energy
DSA directed self-assembly
Suggested Citation:"Appendix D: Acronyms." National Academies of Sciences, Engineering, and Medicine. 2019. High-Entropy Materials, Ultra-Strong Molecules, and Nanoelectronics: Emerging Capabilities and Research Objectives: Proceedings of a Workshop. Washington, DC: The National Academies Press. doi: 10.17226/25106.
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EUVL extreme ultraviolet lithography
FCC face-centered cubic
FET field effect transistor
FinFET fin field effect transistor
GPa gigapascal
h-BN hexagonal boron nitride
HCP hexagonal-close packed
HEA high-entropy alloy
ILP instruction-level parallelism
IMEC Interuniversity MicroElectronics Center
MOSFET metal-oxide-semiconductor field effect transistor
MPEA multi-principal-element alloy
NIST National Institute of Standards and Technology
NMMB National Materials and Manufacturing Board
NRI Nanoelectronics Research Initiative
ORNL Oak Ridge National Laboratory
PEB perpendicular exchange bias
PI principal investigator
SEM scanning electron microscopy
TCAD technology computer-aided design
TEM transmission electron microscopy
TMD transition metal dichalcogenide
TPa terapascal
VAN vertically aligned nanocomposite
XML extensible markup language
Suggested Citation:"Appendix D: Acronyms." National Academies of Sciences, Engineering, and Medicine. 2019. High-Entropy Materials, Ultra-Strong Molecules, and Nanoelectronics: Emerging Capabilities and Research Objectives: Proceedings of a Workshop. Washington, DC: The National Academies Press. doi: 10.17226/25106.
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Suggested Citation:"Appendix D: Acronyms." National Academies of Sciences, Engineering, and Medicine. 2019. High-Entropy Materials, Ultra-Strong Molecules, and Nanoelectronics: Emerging Capabilities and Research Objectives: Proceedings of a Workshop. Washington, DC: The National Academies Press. doi: 10.17226/25106.
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Page 74
Suggested Citation:"Appendix D: Acronyms." National Academies of Sciences, Engineering, and Medicine. 2019. High-Entropy Materials, Ultra-Strong Molecules, and Nanoelectronics: Emerging Capabilities and Research Objectives: Proceedings of a Workshop. Washington, DC: The National Academies Press. doi: 10.17226/25106.
×
Page 75
Suggested Citation:"Appendix D: Acronyms." National Academies of Sciences, Engineering, and Medicine. 2019. High-Entropy Materials, Ultra-Strong Molecules, and Nanoelectronics: Emerging Capabilities and Research Objectives: Proceedings of a Workshop. Washington, DC: The National Academies Press. doi: 10.17226/25106.
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Page 76
High-Entropy Materials, Ultra-Strong Molecules, and Nanoelectronics: Emerging Capabilities and Research Objectives: Proceedings of a Workshop Get This Book
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High-entropy materials, ultra-strong molecules, and nanoelectronics have become a focus of active research because of their unique potential and applications. Global research is rapidly accelerating and unlocking major recent breakthroughs. It is important to highlight these recent developments and explore possibilities for future research and applications.

The National Academies convened a workshop on February 10-11, 2016 to discuss issues in defense materials, manufacturing, and infrastructure. Key topics of discussion included emerging capabilities and research objectives for ultra-strong molecules, high-entropy materials, and nanoelectronics. This publication summarizes the presentations and discussions from the workshop.

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