D
Acronyms
1D | one-dimensional |
2D | two-dimensional |
3D | three-dimensional |
AFM | atomic force microscopy |
AIMD | ab initio molecular dynamic |
ALD | atomic-layer deposition |
BCC | body-centered cubic |
CALPHAD | Computer Coupling of Phase Diagrams and Thermochemistry |
CCA | complex concentrated alloy |
CMOS | complementary metal-oxide-semiconductor |
COI | community of interest |
CVD | chemical vapor deposition |
DFT | density functional theory |
DMMI | Defense Materials Manufacturing and Infrastructure |
DoD | Department of Defense |
DOE | Department of Energy |
DSA | directed self-assembly |
EUVL | extreme ultraviolet lithography |
FCC | face-centered cubic |
FET | field effect transistor |
FinFET | fin field effect transistor |
GPa | gigapascal |
h-BN | hexagonal boron nitride |
HCP | hexagonal-close packed |
HEA | high-entropy alloy |
ILP | instruction-level parallelism |
IMEC | Interuniversity MicroElectronics Center |
MOSFET | metal-oxide-semiconductor field effect transistor |
MPEA | multi-principal-element alloy |
NIST | National Institute of Standards and Technology |
NMMB | National Materials and Manufacturing Board |
NRI | Nanoelectronics Research Initiative |
ORNL | Oak Ridge National Laboratory |
PEB | perpendicular exchange bias |
PI | principal investigator |
SEM | scanning electron microscopy |
TCAD | technology computer-aided design |
TEM | transmission electron microscopy |
TMD | transition metal dichalcogenide |
TPa | terapascal |
VAN | vertically aligned nanocomposite |
XML | extensible markup language |
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