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MANUFACTURING TRENDS IN ELECTRONIC INTERCONNECTION TECHNOLOGY
THE NATIONAL ACADEMIES PRESS
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NOTICE: The project that is the subject of this report was approved by the Governing Board of the National Research Council, whose members are drawn from the councils of the National Academy of Sciences, the National Academy of Engineering, and the Institute of Medicine. The members of the committee responsible for the report were chosen for their special competences and with regard for appropriate balance.
This study was supported by Contract No. N00014-00-G-0230 between the National Academy of Sciences and the Department of Defense. Any opinions, findings, conclusions, or recommendations expressed in this publication are those of the authors and do not necessarily reflect the views of the organizations or agencies that provided support for the project.
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COMMITTEE ON MANUFACTURING TRENDS IN PRINTED CIRCUIT TECHNOLOGY
DAVID J. BERTEAU, Chair,
Clark and Weinstock
KATHARINE G. FRASE,
IBM Microelectronics
CHARLES R. HENRY,
U.S. Department of Defense (retired)
JOSEPH LaDOU,
University of California, San Francisco
KATHY NARGI-TOTH,
Technic, Inc.
ANGELO M. NINIVAGGI, JR.,
Plexus Corporation
MICHAEL G. PECHT,
University of Maryland
E. JENNINGS TAYLOR,
Faraday Technology, Inc.
RICHARD H. VAN ATTA,
Institute for Defense Analyses
ALFONSO VELOSA III,
Gartner, Inc.
DENNIS F. WILKIE,
Compass Group, Ltd.
Staff
TONI MARECHAUX, Study Director
MARTA VORNBROCK, Research Assistant
LAURA TOTH, Senior Program Assistant
BOARD ON MANUFACTURING AND ENGINEERING DESIGN
PAMELA A. DREW, Chair,
The Boeing Company
CAROL L.J. ADKINS,
Sandia National Laboratories
GREGORY AUNER,
Wayne State University
RON BLACKWELL,
AFL-CIO
THOMAS W. EAGAR,
Massachusetts Institute of Technology
ROBERT E. FONTANA, JR.,
Hitachi Global Storage Technologies
PAUL B. GERMERAAD,
Intellectual Assets, Inc.
TOM HARTWICK, Adviser,
Snohomish, Washington
ROBERT M. HATHAWAY,
Oshkosh Truck Corporation
PRADEEP K. KHOSLA,
Carnegie Mellon University
JAY LEE,
University of Wisconsin, Milwaukee
DIANA L. LONG, Consultant,
Charleston, West Virginia
MANISH MEHTA,
National Center for Manufacturing Sciences
NABIL Z. NASR,
Rochester Institute of Technology
ANGELO M. NINIVAGGI, JR.,
Plexus Corporation
JAMES B. O’DWYER,
PPG Industries
HERSCHEL H. REESE,
Dow Corning Corporation
H.M. REININGA,
Rockwell Collins, Inc.
LAWRENCE J. RHOADES,
Ex One Corporation
JAMES B. RICE, JR.,
Massachusetts Institute of Technology
DENISE F. SWINK, Adviser,
Germantown, Maryland
ALFONSO VELOSA III,
Gartner, Inc.
BEVLEE A. WATFORD,
Virginia Polytechnic University
JACK WHITE,
Altarum
Staff
TONI MARECHAUX, Director
Preface
Today’s defense systems incorporate an increasing number of electronic components, intended to enable these systems to be more accurate, more sophisticated, and more effective. Advances in printed circuits and associated interconnection—an integral technology—have enabled this trend, and these advances are expected to continue to enable future combat systems.
To examine a number of issues surrounding the manufacturing and supply of these components, the National Research Council convened a panel of experts—the Committee on Manufacturing Trends in Printed Circuit Technology—to examine trends in electronics interconnection technology and manufacturing and their effect on U.S. defense needs.
The charge to the committee was specifically to do the following:
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Examine worldwide and U.S. trends in technology investment and manufacturing competences for printed circuit boards.
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Assess the role of printed circuit boards in maintaining U.S. military capability, especially in meeting unique defense needs.
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Examine current laws, policies, and regulations that pertain to printed circuit board manufacturing and their impact on maintaining future military capability.
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Describe potential strategies for research, development, and manufacturing for printed circuit boards to meet both legacy and future U.S. defense needs.
A meeting was held December 13 and 14, 2004, attended by committee members, expert consultants, and Department of Defense (DoD) representatives. Technical topics were presented and discussed covering the general areas of system considerations, the suitability of current supply practices, the influence of new technologies, and technology insertion. DoD representatives provided a useful overview and rationale to set the stage for the discussions. Formal presentations were brief in order to allow for significant interactions between committee members and guests to home in on responses to the tasks listed above. After the meeting, the committee continued to gather information and to discuss and deliberate on findings, conclusions, and recommendations.
This report has been reviewed in draft form by individuals chosen for their diverse perspectives and technical expertise, in accordance with procedures approved by the National Research Council’s Report Review Committee. The purpose of this independent review is to provide candid and critical comments that will assist the institution in making its published report as sound as possible and to ensure that the report meets institutional standards for objectivity, evidence, and responsiveness to the study charge. The review comments and draft manuscript remain confidential to protect the integrity of the deliberative process. We wish to thank the following individuals for their review of this report: Doug Freitag, Bayside Materials Technology; Steven P. Gootee, SAIC; Carol Handwerker, Purdue University; R. Wayne Johnson, Auburn University; Paul G. Kaminski, Technovation, Inc.; Robert Pfahl, iNEMI; Joe Schmidt, Raytheon; and Frank Talke, University of California, San Diego.
Although the reviewers listed above have provided many constructive comments and suggestions, they were not asked to endorse the conclusions or recommendations, nor did they see the final draft of the report before its release. The review of this report was overseen by Elsa Garmire, Dartmouth College. Appointed by the National Research Council, she was responsible for making certain that an independent examination of this report was carried out in accordance with institutional procedures and that all review comments were carefully considered. Responsibility for the final content of this report rests entirely with the authoring committee and the institution.
The committee also acknowledges the speakers from government and industry who took the time to share their ideas and experiences. H.M. Reininga, Board on Manufacturing and Engineering Design liaison to the committee, also greatly assisted the work of the committee through his participation in many of the committee’s activities. Finally, the committee acknowledges the contributions to the completion of this report from the staff of the National Research Council, including Marta Vornbrock, Laura Toth, and Toni Marechaux, as well as those of Albert Alla, an intern at the National Research Council who assisted in background research for the report.
David J. Berteau, Chair
Committee on Manufacturing Trends in Printed Circuit Technology
Tables, Figures, and Box
TABLES
2-1 |
Dollar Value of Printed Circuit Board Production by Global Region in 2003, |
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2-2 |
Number of Independent U.S. Companies Manufacturing Rigid PrCBs, 1995, 2000, and 2003, |
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2-3 |
Annual Sales for Top Ten Companies in Printed Circuit Industry, 2000 and 2003, |
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2-4 |
Companies Qualified to Supply U.S. Military Needs Under MIL-PRF-31032, |
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3-1 |
Technology Assessment for Different Military System Time Frames, |
FIGURES
1-1 |
An array of printed circuit boards in various sizes, form factors, and materials, |
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3-1 |
Product and process requirements in a commercial-military integration framework, |
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3-2 |
A simple risk model, |
BOX
3-1 |
The SLQ-32 Electronic Warfare System, |