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Research Opportunities for Materials with Ultrafine Microstructures (1989) / Chapter Skim
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Pages 27-27

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From page 27...
... Increased adatom energy at the substrate plus increased chemical reactivity in a gas discharge allow fabrication of dense, adherent, and fully reacted dielectric compounds without external substrate heating. By the.use of multiple sources, one can control composition and thickness ~ ~~ ~ Substrate temperature.
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Key Terms

  • particle size
  • substrate heating
  • starting materials
  • particle sizes
  • increased chemical

  • methods exist
  • discharge allow
  • prominent advantage
  • substrate plus
  • polymeric substrates


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