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'INTRODUCTION'
Pages 3-6

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From page 3...
... o Technologies will be combined for enhanced functionality, from the merging of analog and digital functions to achieving compatibility among presently incompatible electronics materials combinations. o Three-dimensional devices will be fabricated with lateral modification on a nanometer scale, which will allow very small, high-performance structures with couplings, thereby beginning a new era of unwired arrays of nonstandard transistor structures.
From page 4...
... This theme is reflected in the organization and topics of the panel's report, as follows: SOLID STATE ELECTRONICS o Innovative Device Focus, for combining materials, structures, and fabrication research. o Effective Utilization of Computing Power, for merging advanced characterization techniques with simulation and modeling to achieve process control, o Better Understanding of Manufacturing and Reliability Issues.
From page 5...
... We recognize important Navy needs for scientific research in regions of power/frequency space where solid state electronics cannot provide required characteristics, as for example, gyrotrons and ubitrons, as well as more traditional slow wave devices such as TWT and CFTs. Although there was no specific expertise on the panel to address this area, we believe that a modest investment in vacuum electronics should be part of the Navy's electronics portfolio.


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