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E MANUFACTURING TECHNOLOGIES OF COATING PROCESSES
Pages 78-82

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From page 78...
... As with pack cementation, for pulse aluminizing and SNECMA vapor phase aluminizing, the retorts are loaded into an appropriate furnace for the thermal cycle. Because of the increased path length for vapor transport, the out-of-pack methods favor an increased tendency for outward growth and a generally reduced deposition rate.
From page 79...
... Extensive literature exists on feedstock alloys and ceramic materials for plasma spray. In addition to the starting material and its particle-size distribution, the microstructure of a plasma-sprayed coating also depends on the processing parameters, including plasma power, plasma gas composition, pressures and flow rates, powder injection details and carrier flow, torch/substrate dislance, as well as other subtle factors.
From page 80...
... Direct-current voltages are generally applied, but radio frequency potentials must be applied to overcome charge accumulation for insulating targets. Because of the high ionization efficiency in the magnetron cavity, intense plasma discharges that provide high sputtering rates can be maintained at moderate voltages, even for low pressures.
From page 81...
... This has led to the use of process capability studies prior to committing to production process qualifications, the use of statistical process control once in production to assess manufacturing process variation, and the use of Taguchi and integrated process management to make the process more robust (Slater, 1991; Taguchi, 1993~. The process capability ratio, Cpk, is a simple but powerful measure of the ability of a manufacturing process to meet specification requirements and is defined as Cpk = (6 standard deviation)
From page 82...
... 1973 A high energy plasma coating process. In the Seventh International Metal Spraying Conference, London, September 1~14.


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