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Microelectromechanical Systems Advanced Materials and Fabrication Methods (1997) / Chapter Skim
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5 Assembly, Packaging, and Testing
Pages 38-50

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From page 38...
... MEMS packaging is usually approached by individual manufacturers on a specialized, application-specific basis in which problems are solved independently. Very little publicly available work has been conducted on the basic aspects of generic packaging and assembly or on standardized packaging methodologies for MEMS.
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From page 39...
... Examples include electrical, optical, mechanical, chemical, hydraulic, and magnetic signals (Figure 5-2~. Conduits into and out of the packaged MEMS for these signals must be designed to avoid distortion.
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From page 40...
... Corrosion problems can threaten the operation of MEMS powering systems because of the different operating environments in which the systems may operate and because not all MEMS devices can be hermetically isolated. Fluidics Coupling fluids into and out of MEMS presents significant challenges to systems integrators.
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From page 41...
... silicon microvalves for gas flow control, some of which are packaged in an almost standard transistor outline (T08) electrical chip package (e.g., Redwood package fittings)
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From page 42...
... The development of generic packaging methodologies would eliminate duplication and the reworking of old problems for each new MEMS venture. Although it is not likely that just a few approaches to packaging MEMS will be sufficient, a set of capabilities and methodologies can be defined and developed that address the needs of each basic sensing and actuation domain (e.g., fluid handling, optical coupling, mechanical integration)
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From page 43...
... Some manufacturers have found ways of using conventional handling equipment for MEMS chips by modifying it to account for specific MEMS sensitivities. D· ~ clog For components that are bulk micromachined, the deep etching techniques used as part of the process can sometimes be used to partially or fully separate an individual die from the wafer during the machining process.
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From page 44...
... A very big payoff will accrue to designers who adapt these package parts to packaging demands for MEMS. Stresses on Packaging Differences in thermal-expansion coefficients between packaging materials and the MEMS chips are expected to cause temperature-variable stress patterns in packaged MEMS.
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From page 45...
... Hybrid assembly for MEMS can be done using equipment, materials, and testing methods common in the IC industry, including tools for die attachment, chip pinout, and heat removal, as well as for the measurement of signal-rise time, power-lead inductance, power-supply current, and interline coupling. The design of hybrid assembly also must consider factors like the wiring configuration for multiple chips and propagation delays as the signal is relayed between chips (NRC, 1990~.
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From page 46...
... Figure 5-10 shows the formation of a thermopneumatic microvalve using glass-to-silicon anodic wafer bonds. The silicon wafers are patterned and etched separately and then precisely aligned using equipment similar to equipment used in IC processing for lithography.
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From page 47...
... assembly is completed, the separation of the individual die from the sheet can lead to additional complications, especially if the bonding pads formed on one wafer have been overlapped by the attached wafer. For biological applications, lower temperature bonding methods will have to be developed.
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From page 48...
... ad process now for Dacron of ~ no~ly-open, ~e~opneum~c~ly-ac~^d ~crov~ve: (a boas ~ Only gilled in Pax Alar; A Pax w^r 1s ~1~lized; (c) ~-r~e w^r 1s deAned 11~ogr~bc~1y (using gold, oxide, ~d pbo10=s1~ maskst (~ ~-r~e w^r 1s e~d 1n KOH ~d mas~ng m-~s ~ s~pped; (e)
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From page 49...
... Outputs may include electrical, optical, mechanical, chemical, hydraulic, or magnetic signals, singly or in concert. Standard test devices and methods are required to determine the mechanical properties of MEMS devices, to demonstrate the repeatability and reliability of mechanical devices, and to facilitate quality-control practices.
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From page 50...
... Conclusion. Packaging, which has traditionally attracted little interest compared to device and process development, represents a critical stumbling block to the development and manufacture of commercial and military MEMS.
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Key Terms

  • mems devices
  • generic packaging
  • hybrid assembly
  • analog devices
  • packaging methodologies

  • standard transistor
  • packaging requirements
  • operating environments
  • mems assembly
  • silicon wafer

  • specific mems
  • transistor outline
  • mechanical properties
  • wafer surface
  • electronics industry

  • undesirable parameters
  • surface micromachining
  • contact forces
  • assembly methods
  • include electrical

  • test devices
  • packaging steps
  • military mems
  • characterization methods
  • mems wafers

  • bulk micromachined
  • mems requirements
  • critical stumbling
  • mems interfaces
  • mems package


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