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Keynote Address
Pages 54-59

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From page 54...
... Moore hoped that his remarks would shine light on how to build foundations for the future. CHANGES IN THE RESEARCH AND DEVELOPMENT ENVIRONMENT The contributions of large industrial research laboratories, which have been so important in the past, have been diminishing in recent years.
From page 55...
... That is a little less than one-eighth of a microdollar per transistor, or 120 nanobucks. The continuous decrease in costs and the corresponding improvement in performance have driven semiconductor industry revenues to $150 billion annually, and the industry in turn supports a $1 trillion electronics industry.
From page 56...
... The only constants are extremely rapid change and falling prices; on average, prices for semiconductor devices fall 20 to 30 percent per year, with the price of some devices falling as much as 50 percent in a single year. There is no other industry like the semiconductor industry, and it leaves much room for blunder by corporate leadership.
From page 57...
... On average, that silicon wafer represents $1 billion per acre, maybe a half a billion for DRAMs and several billion for microprocessors. The main challenge for the industry is really a real estate development problem: how to pack more circuits on the wafer with greater functionality in such a way that, while maintaining historical rates of price decreases, the revenue stream from the wafer remains at $1 billion per acre.
From page 58...
... using normal optical techniques in conjunction with multiple reflectors holds promise, yet EUV may not be able to use light that is smaller than 13 rim in wavelength. Two further challenges affecting the industry's future are design in a few years, a chip will contain 1 billion transistors, and it will be a huge challenge to improve design techniques so that ever-more complex designs can function reliably, and change in wafer size Dr.
From page 59...
... However, he said that international collaboration among firms and universities holds great potential. Because the research challenges in making devices with circuits with ever-smaller line widths are enormous, international collaboration might be useful, as it is in the conversion to the 300-mm wafer size.


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