Linkages Manufacturing Trends in Electronic Interconnection Technology (2005) / Chapter Skim
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1 Background and Overview
1 Background and Overview
Pages 5-10
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From page 5... ...
Today, markets for this interconnection technology range across the whole of the global economy, and include the following areas: · Government, military, and aerospace uses; · Medical devices; · Automotive electronics; · Computers and business electronics; · Consumer electronics; · Industrial electronics and instrumentation; and · Communication. Today, interconnecting electronics in increasingly complex systems is leading to complex designs, components, and systems.
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Higher-end circuit board substrates for industrial or selected commercial applications are typically made of the material designated FR-4. This is a woven fiberglass mat impregnated with a flame-resistant epoxy resin.
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From page 7... ...
BOARD DESIGN The main function of printed boards is to support and interconnect the electronic components mounted on them; they may also serve to dissipate heat and protect components. The base materials, wires, and wire layers vary widely; design decisions are made according to the specific requirements of the application.
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From page 8... ...
· Many techniques are involved. These may include computer-aided design and computer-aided manufacturing, optical image transfer, high-speed and laser drilling, dielectric metallization, copper electroplating, tin electroplating, acid and alkaline etching, nickel and gold electroplating, laser direct imaging, hot-air leveling for final finish metals such as tin, liquid photoimageable resists, vacuum or autoclave lamination for multilayer products, automated x ray systems for registration of layers, flying probe and compliant pin electrical testing, and automated optical inspection.
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From page 9... ...
systems designed to provide the high level of accuracy needed for the fabrication of a PrCB. The specialized equipment set includes laser photo plotters; PLC chemical processing lines; numerically controlled devices; hot oil, electric, or autoclave lamination presses; automated optical inspection systems; automated exposure devices; roller or screen coating systems for dielectric applications; and multilayer registration tools.
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From page 10... ...
Sources included the 2003 CIA World Fact Book; the Government Electronics and Information Association 15th Annual Forecast; the Information Technology Association of America; the Congressional Budget Office Summary Update for Fiscal Year 2003; and IPC, the Association Connecting Electronics Industries. The committee realizes that many additional sources for such data are available via an Internet search and that the error in these numbers may be 50 percent or more.
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