21st Century Innovation Systems for Japan and the United States Lessons from a Decade of Change: Report of a Symposium (2009) / Chapter Skim
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Semiconductor Consortia in Japan: Experiences and Lessons for the Future--Shuzo Fujimura
Semiconductor Consortia in Japan: Experiences and Lessons for the Future--Shuzo Fujimura
Pages 126-137
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From page 126... ...
project in facilitating the rise of Japanese semiconductor industries in the 1980s (Morris (Morris 1990) , Japan launched an armada of projects that mirrored this strategy, includ , including the Semiconductor Leading Edge Technologies, Inc.
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From page 127... ...
related projects: One was the "development of high speed EB direct writing equipment." Two were X-ray lithography-related projects, one of which was the "development of proximity X-ray lithography." Three other projects were the "development of ArF lithography," "plasma physics and diagnostics," and "development of surface cleaning and simulation." These projects yielded impressive results, including 1,288 technical disclosures, 246 patent applications, and 101 registered patents. As an example of the content, the in "plasma physics and diagnostics" produced basic technology development in correlating process evaluation indicators such as selectivity and process distribution to equipment parameters such as process pressure and plasma electron density.
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From page 128... ...
In this paper, the problems of consortia related to the Japanese semiconductor industry are discussed by focusing on the three consortia concerned with develop ment of semiconductor devices because, both the decline of the Japanese semi conductor industry and the inefficiency of the consortia seem to be caused by the PRePublication coPy
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From page 129... ...
Thus, MIRAI, Selete, and ASPLA target the implementation of semiconductor devices; each has a target technology level classified according to the technology node size, such as MIRAI on 45nm, Selete on 90-65nm, and ASPLA on 90nm. Then, as development tasks to which the three consortia relate mutually, the specific research themes are set, such as "research on elemental PRePublication coPy
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From page 130... ...
Selete targets the completion of process modules and ASPLA targets the completion of actual device processes. The design concept for the three projects is that MIRAI investigates materials, Selete introduces them into process modules applicable to mass production, and ASPLA builds experimental devices with them.
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From page 131... ...
For the design of all transistor equip ments and for the choice of High-k material today, High-k materials are selected based on transistor electrical characteristics with the material, and the transistor structure depends on the selected High-k material. Device manufacturers, equip 15The VLSI project efficiently contributed to the rapid evolution of Japanese chip makers by supply ing these new technologies.
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From page 132... ...
Creating an accurate copper interconnection using CMP therefore requires the sharing of information among the equipment vendors, the material supplier, and the device manufacturer. Japanese semiconductor device manufacturers believe that NEC is one year behind Micron Technologies and Motorola of the United States and two years behind Samsung of South Korea late in starting the development of CMP (Chuma (Chuma and Hashimoto 2007)
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From page 133... ...
The stated research task is the Development of tools that can assist in the comprehensive evaluation of not only the electrical characteristics of semiconductor devices but also their impact on reliability, which we call "integrated component development aid tools," in addi tion to the mutual influence between materials, and the same between materials and processes. Selete is organized only by device manufacturers, and there is no room for the equipment and material manufacturers to participate in its management.
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From page 134... ...
Global market share of the Japanese device manufacturers is roughly 27 percent, and the share of the Japanese equipment manufacturers is roughly 30 percent. In contrast, the global market share of the Japanese material manufac turers is about 70 percent, which means material manufactures have the highest competitive power relatively.
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From page 135... ...
toWaRD tHe inteGRation oF VaRiouS tyPeS oF KnoWleDGe Given that Japanese device, equipment, and material manufacturers could not build an efficient information exchange system, it is not surprising that the device manufacturers did not understand the qualitative changes of the technologies required for the devices. Some ascribe the decline of the Japanese semiconductor industry in the 1990s to equipment and material manufacturers, saying that the advantage in device manufacturing technology was lost because equipment and material manufacturers had exported products that had been refined, using the knowledge and experiences of the device manufacturers.
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From page 136... ...
They are equipment manufacturers, device manufacturers, and set manufacturers. In other words, the research topics of IMEC are all on industry boundaries, and it works as the bridges that link different sectors.
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From page 137... ...
At IMEC, device, equipment, and material manufacturers can exchange their information while protecting their own differentiating technology secrets through adequate theme selection and organization management. There is no need for device manufacturers to enclose equipment and material manufacturers to assimilate knowledge from them.
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