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3 The Nanofab Program
Pages 12-15

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From page 12...
... The Nanofab tooling is a mixture of inherited equipment from the NIST complementary metal oxide semiconductor facility (deposition, RIE, film thickness measurement, diffusion, contact print lithography, and SEM applications) , new RIE and characterization tooling and FIB tooling, and new nanofabrication-specific tooling (electron-beam [or e-beam]
From page 13...
... The process activities described during the review are summarized in Appendix A The process examples explicitly described during the review imply that the Nanofab program has as its major focus the fabrication of MEMS structures and as its secondary focus, the fabrication of a single layer of nano features using one photolithography step that is, a combination of an e-beam exposure, a metal deposition, and a subtractive or additive removal of material.
From page 14...
... The Nanofab facility requires oversight in several areas: Chart e-beam activity in the laboratory, thereby justifying a two e-beam facility; Document tool utilization; Chart processing experiments in the facility to create a process history and an activity history for the facility; Develop a tool plan and a complementary staffing plan to support the tooling plan; Develop for the outside user a set of charging and access methods that is based on clear criteria for allocating resources; Develop a plan to remedy HVAC, air handling, and DI water deficiencies in the laboratory; and Develop a set of process capabilities complemented with process modules for the facility. The Nanofab program should be reviewed again during the 2010 calendar year to gauge progress in meeting the Nanofab goal of state-of-the-art nanoscale processing.
From page 15...
... Some essential facility capabilities such as air handling are reported to be inadequate. Staffing levels seem low.


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