Materials for High-Density Electronic Packaging and Interconnection (1990) / Chapter Skim
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EXECUTIVE SUMMARY
EXECUTIVE SUMMARY
Pages 1-8
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From page 1... ...
The rapid advances in integrated circuit chip capabilities will continue to increase demand for enhanced interconnect capability as regards numbers of connections (pinouts) , pinout configuration, heat removal, signal rise time, signal transit time, power lead inductance, power supply current, and environmental protection.
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From page 2... ...
Many different properties and compatibilities must be optimized simultaneously. Issues of importance include the following: · coefficient of thermal expansion · dielectric properties · thermal conduc t ivi ty · electrical conductivity · interracial chemis try · adhesion ~ mechanical strength and toughness · impact strength · long-term stability purity (including absence of radioactivity)
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From page 3... ...
The United States has enormous intellectual resources in the university system, and it will be important to bring this potential to bear on the critical area of electronic packaging. Coordination of efforts of the various relevant university engineering and science departments will not be easy for this interdisciplinary field.
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S . industry could be facilitated by selectively removing antitrust restrictions on "buying cooperatives .
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This consortium would develop materials requirements and materials application technology, and would cultivate domestic sources of supply. The analogy with Sematech, the U.S.-based consortium aimed at integrated circuit process equipment, is strong, and the term "Sepatech" was coined for purposes of discussion among committee members.
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From page 6... ...
military systems must be hermetic, which has caused military electronics systems to lag considerably in terms of overall capabilities. The committee urges that alternative means be found to allow military hardware to move into the mainstream of electronic packaging, while still preserving reliability over long periods in difficult environments.
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From page 7... ...
Briefly, this includes copper, gold, and aluminum metallization with progress on high reliability in high current density; alumina and aluminum nitride, and other ceramic processing for preparation of advanced interconnect details; further development of epoxies for encapsulation, board resins, and adhesives; and development of polyimides and other high-temperature polymers for substrates, interlayer dielectrics, and other uses. Benzocyclobutanes are a very promising class of low dielectric constant polymers that are beginning to appear in electronic products.
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From page 8... ...
11. The ability to design materials with thermal expansion tailored to the appl ication is emerging and should be extremely important for interconnect s true tures
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