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Materials for High-Density Electronic Packaging and Interconnection (1990) / Chapter Skim
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APPENDIX A: GLOSSARY OF SOME TERMS AND ACRONYMS USED IN THE REPORT
Pages 105-108

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From page 105...
... in a package t see "chip"] DIP - dual in-line package DRAM - dynamic random access memory (' - real part of dielectric permitt~vity (E '/6O = k)
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From page 106...
... PCB - printed circuit board [used interchangeably with EWE in the text PGA - p in grid array P-g'ass - phosphosilicate glass used for chip passi~ra~ion POP - b~pc~la' dove ce ~ ayer structure (hole-rich layer/electron-rich lay er~hole - rich layer) ~ bars Astor P-H - pi Ted through holes PUB - pro need wi.~ir~5 board fused interchangeably with PCB in the text
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From page 107...
... 107 RIE - reactive ion etching RISC - reduced instruction set computer (or processor) SMA - surface -mount assembly SCM - single chip modules S RAM - static random access memory TAB - tape automated bonding TCE - thermal coefficient of expansion Acts [see "CTE" ~ Via - a conducting through path perpendicular to the plane of the substrate ~ see also blind via ~ NISI - wafer- scale integration
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Key Terms

  • access memory
  • random access
  • printed circuit
  • fused interchangeably
  • phosphosilicate glass

  • dynamic random
  • package dram
  • circuit board
  • grid array
  • text pga

  • board fused
  • ic chip
  • bars astor
  • dove ce
  • holes pub

  • pi ted
  • rich layer
  • ayer structure
  • finished wafer


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