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Materials for High-Density Electronic Packaging and Interconnection (1990) / Chapter Skim
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APPENDIX C: MICROPROCESSOR OPERATING AND STRUCTURAL PARAMETERS
Pages 115-118

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From page 115...
... These figures were prepared from information drawn from trade journals, forecasting reports, and the direct knowledge of committee members of developments in the field. It should be clear that predictions beyond 10 years are hazardous, at best.
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From page 117...
... a:: ~ :.: ~ _: : 1 1 _ ·. ,~ 1 1 1 1 1 980 1 990 YEAR Figure C-1 Microprocessor power requirements: 103 9 8 7 6 5 4 3 2 ~ 102 _ 9 8 7 6 5 4 3 2 1 2000 history and forecast 1 1 o 1 1980 1 990 YEAR 2000 Figure C-2 Microprocessor lead count (I/O)
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From page 118...
... 118 107 1o6 105 C, 104 103 ~ 1 1 1 o 2 1980 1 990 2000 YEAR Figure C-3 Microprocessor gate count: history and forecast. 109 8 6 4 3 2 1o8 8 _ ^ 6 _ I, 4 _ ~ 3 _ y 2 _ O 107 _ 8 6 4 3 2 1o6 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 2000 1 980 YEAR 1 990 Figure C-4 Microprocessor clock rate: history and forecast
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Key Terms

  • information drawn
  • direct knowledge
  • trade journals
  • forecasting reports
  • predictions beyond

  • microprocessor lead
  • lead count
  • microprocessor power


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