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Materials for High-Density Electronic Packaging and Interconnection (1990) / Chapter Skim
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APPENDIX D: EXAMPLES OF DEVELOPMENTS IN BOARD TECHNOLOGIES
Pages 119-122

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From page 119...
... Appendix D 1 EXAMPLES OF DEVELOPMENTS IN BOW TECHNOLOGIES Various technologies have been developed for assembling complex circuits employing novel circuit and interconnect designs. Some objectives include attempts to minimize the interconnect lengths and make manufacturing reasonably simple, with the possibility of disassembly for repair and circuit changes Two of these are shown in the accompanying figures, D-1 and D-2, based on sketches furnished by TRW.
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From page 121...
... FORCE / 2 SIDED PC BOARD . , BUTTON ~' BCOTA8ROAR: FORCE ~ PC 50ARD 2 SiOED PC BOARD 1 ~ PLATED FoRCE THRU HOLES PLATED THRU HOLES Figure D-2 Button board interconnection concept developed by TRW.
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Key Terms

  • thru holes
  • board spacer
  • board technology
  • button boards
  • multilayer board

  • plated thru
  • board buttons
  • circuit assembly
  • boards typical
  • force thru

  • employing button
  • concept developed
  • board interconnection
  • combination button
  • interconnect multilayer

  • assembly employing
  • holes plated
  • interconnection concept
  • surf ace
  • plated force

  • teflon glass
  • pc board
  • sided pc
  • clamp structure
  • base plate

  • sioed pc
  • heat sink
  • icolo plate
  • functional unit
  • gold plated


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