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APPENDIX E: MATERIALS PROPERTIES
Pages 123-126

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From page 123... ... Sources of these data ranged from original literature to review articles, monographs, and handbooks, too numerous to be listed here. The reader is reminded that property data found in these reports vary widely, so the values listed should be regarded as representative and indicative of what properties are available for packaging design and manufacture. Read the entire page →
From page 125... ... (W/cm C) Uses aluminum 660 2.72.6xlO-6 23 2.1 Chip conductor and wire bonds Gold 1063 19.32.4xlO 6 14 3.4 Hybrid conductor and wire bonds Copper 1083 8.91.7x10-6 17 3.8 Lead frame and hybrid, Pea, and conductor Lead 327 112x10-5 29 0.3 Solder attach Nolybdenum 2610 104.8xlO-6 4 1.3 Co-fired on ceramic conductor Tungsten 3380 195.5x10-6 4 1.5 Co-fired on ceramic conductor TABLE E-2 Interconnect i on and Packag i ng Mater i a l s: Organ i c max use temp p a' a" a TCE He ~ C) Read the entire page →
From page 126... ... 1,600 4.0 9.5 0.003 1014 6.5 0.3 Hybrid substrates/chip carriers Silica (fused) 1,100 2.2 3.8 <10-4 ,1ol7 0.6 0.02 Filler for molding epoxies Si licon nitride 2,000 3 6 NM 1016 0.8 0.3 Candidate substrates Aluminum nitride 1,800 3.3 8.9 0.004 lo13 4.5 3.2 Candidate substrates Silicon carbide 2,100 3.2 40 0.2 1013 3 7 2.7 Candidate substrates Silicon 1,400 2.3 12 NM V 2.6 1.5 Candidate substrates Diamond >3,500 3.5 5.7 NM >102� 0.9 20 Candidate encapsulation Glass-ceramic >1,000 >4 7-10 NM V >3 0.05 Candidate substrates Beryllia 1,500 3 7 10-3 lol4 6 2.6 Chip carriers _ .. Read the entire page →

From page 123...

... Sources of these data ranged from original literature to review articles, monographs, and handbooks, too numerous to be listed here. The reader is reminded that property data found in these reports vary widely, so the values listed should be regarded as representative and indicative of what properties are available for packaging design and manufacture.

Read the entire page →

From page 125...

... (W/cm C) Uses aluminum 660 2.72.6xlO-6 23 2.1 Chip conductor and wire bonds Gold 1063 19.32.4xlO 6 14 3.4 Hybrid conductor and wire bonds Copper 1083 8.91.7x10-6 17 3.8 Lead frame and hybrid, Pea, and conductor Lead 327 112x10-5 29 0.3 Solder attach Nolybdenum 2610 104.8xlO-6 4 1.3 Co-fired on ceramic conductor Tungsten 3380 195.5x10-6 4 1.5 Co-fired on ceramic conductor TABLE E-2 Interconnect i on and Packag i ng Mater i a l s: Organ i c max use temp p a' a" a TCE He ~ C)

Read the entire page →

From page 126...

... 1,600 4.0 9.5 0.003 1014 6.5 0.3 Hybrid substrates/chip carriers Silica (fused) 1,100 2.2 3.8 <10-4 ,1ol7 0.6 0.02 Filler for molding epoxies Si licon nitride 2,000 3 6 NM 1016 0.8 0.3 Candidate substrates Aluminum nitride 1,800 3.3 8.9 0.004 lo13 4.5 3.2 Candidate substrates Silicon carbide 2,100 3.2 40 0.2 1013 3 7 2.7 Candidate substrates Silicon 1,400 2.3 12 NM V 2.6 1.5 Candidate substrates Diamond >3,500 3.5 5.7 NM >102� 0.9 20 Candidate encapsulation Glass-ceramic >1,000 >4 7-10 NM V >3 0.05 Candidate substrates Beryllia 1,500 3 7 10-3 lol4 6 2.6 Chip carriers _ ..

Read the entire page →

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APPENDIX E: MATERIALS PROPERTIES Pages 123-126

APPENDIX E: MATERIALS PROPERTIES
Pages 123-126