Materials for High-Density Electronic Packaging and Interconnection (1990) / Chapter Skim
Currently Skimming:
APPENDIX F: EXAMPLES OF MULTICHIP MODULES
APPENDIX F: EXAMPLES OF MULTICHIP MODULES
Pages 127-134
The Chapter Skim interface presents what we've algorithmically identified as the most significant single chunk of text within every page in the chapter.
Select key terms on the right to highlight them within pages of the chapter.
From page 127... ...
These were based on figures found in the literature] and sketches furnished by IBM and the General Electric Company.
|
From page 129... ...
CERAMIC Sl CON SUBSTRATE (METALLIZED) MULLITE \ Figure F-1 Ceramic package developed by Hitachi for Silicon Substrate.
|
From page 130... ...
l ID OOGOOOO0Q oomO 8~9 Of ~ lOO.~Q OOW.~.Q ouoosauua nnn~F,~n~rn / ~ Figure F-4 Three-dimensional assembly of GaAs modules developed by NEC. (After Johnson*
|
From page 131... ...
_ rCMOS EPOXY POLYIMIDE COPPER tOVER SILICON) Figure F-S Multichip module developed by Toshiba.
|
From page 132... ...
COVER ASSEMBLY ~ 132 ~ JACKET on ~ ~HELIUM FILL PORT ~,[ LSI CHIPPED 1 FLANGE:~~9Omm x 90mm CYLINDER~CC SUBSTRATE BASE PLATE Figure F-6 Thermal condition module developed by IBM. (Courtesy of IBMCorp.
|
From page 133... ...
133 -1/0 PlN 80ND ~ PWR / GND / =._~'w-~ - ' ~1 i_ Air KOVAR I~ ALUMINA CANSUBSTRAT FRAME Figure F-7 Cross section of GE modul E (Courtesy of General Electric Co.)
|
Key Terms
This material may be derived from roughly machine-read images, and so is provided only to facilitate research.
More
information on Chapter Skim is available.