Materials for High-Density Electronic Packaging and Interconnection (1990) / Chapter Skim
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1 INTRODUCTION
1 INTRODUCTION
Pages 9-20
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The impact of silicon electronics triggered the era of information processing and continues to produce amazing progress. The size of the circuit elements, the speed of their operation, the minimal power consumed, the cost per element, and the reliability of the circuits have improved dramatically.
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The dependence of the materials properties on the manufacturing process is also important. Electronic packaging includes all structures that are designed to protect the integrated circuits, the attendant interconnections and the related circuitry from physical damage and any other impediment to achieving design performance.
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Signal, power, ground, and timing leads are connected by wire bonding pads. (A TAB inner lead frame can be used for this purpose.
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. ~ FIGURE 1-5 A field of solder bumps with device ready for mounting in C4 attachment (controlled collapse chip connection)
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and do not consume valuable inner layer space with the through-hole .
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Chip carriers (CCs are bonded only to the top surface (surface mount assembly, SMA) of a multilayer circuit, and no grid of holes are needed.
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, in which the lead frame is a thin copper layer supported by polyimide film and all the inner fingers are bonded to the chip pads in a single operation. By supporting the leads on film and eliminating the wire bonding tool, finer lead spacing (about 4 mils)
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. Co-fired ceramics undergo large material shrinkage during processing, and thus present registration difficulties fin multilayer structures.
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Solder is employed for attaching chip packages to circuit board substrates. For DIP through-hole mounting, a solder wave is passed across the back side of the board (i.e., on the side with no components)
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Electrical connections are made with gold wires that go from chip bonding pads to lead frames constructed of copper or an alloy of iron and nickel. The packaged chips are attached by solder to printed circuit boards composed of epoxy-glass (or sometimes polyimide)
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Chapter 4 discusses materials issues, and Chapter 5 gives more specific information and perspective on plastic and ceramic encapsulants, ceramic substrates, and organic printed circuit structures. Chapter 6 presents an analysis of material sources, current trends, and the importance of the field in the context of international competitiveness.
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