Materials for High-Density Electronic Packaging and Interconnection (1990) / Chapter Skim
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6 ORGANIZATIONAL, FUNDING, AND POLICY ISSUES
6 ORGANIZATIONAL, FUNDING, AND POLICY ISSUES
Pages 95-104
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From page 95... ...
This was contrary to the Japanese approach of getting into the low-end, high-volume products, that were then upgraded to the high-end technologies where their new dominance is appearing today . In addition, large Japanese electronics companies are fully integrated from raw materials through the consumer product, giving them full control of all fabrication steps.
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From page 96... ...
Clearly, the system works remarkably well, and the existence of complex electronic apparatus attests to the dedication and expertise of the various contributors along the way. There is, however, very little information flow along ache chain because the materials and processes employed are secret and proprietary at each fabrication stage.
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From page 97... ...
SYSTEMS VERSUS MATERIALS APPROACHES A central technical issue is the balance of package and interconnect materials considerations, building-block approaches, system-architectural approaches, and system-organization approaches ~ Past packaging approaches have not been materials-focused but have stressed configuration of known materials. Past system-performance approaches have focused on parallelism and enhanced building blocks having tighter physical configurations.
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From page 98... ...
· Military systems are tied to conservative approaches, such as hermeticity, no organics inside the package, and the value of old technologies in the face of rapid progress in the commercial world. Nevertheless, the military services have funding, and their willingness to fund (if not to use)
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From page 99... ...
Other Considerations Thus, it seems that packaging is an important consideration in the various consortia formed recently to support advanced electronics system
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From page 100... ...
Therefore, it may be reasonable to work wi thin the structure of the existing consortia and programs to enhance an integrated approach to package and interconnect design in which materials properties and processing are given emphasis at every step. As circuit performance limitations become more and more package-based, the j oint programs will gravitate to des ign factors at the package level, and the materials and combinations of materials involved will be central issues.
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From page 101... ...
Smaller companies can more easily commercialize materials measured in grams rather than tons, but success will depend on the technical depth and patent protection. University laboratories should be highly successful in this general area, and the near future is ripe for materials development in the electronics packaging business.
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From page 102... ...
In printed wiring boards, multichip modules, chip-board assembly technology, and other interconnection media, both countries appear to be equally capable. The United States will do well to study and understand the causes of its loss in relative position in these critical technologies.
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From page 103... ...
So, too, the Department of Energy's National Laboratory system has been well supported, and the National Science Foundation budget permits funding of a number of important technical initiatives. Thus, federal funding appears to be in reasonably good shape in spite of the negative factors mentioned.
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From page 104... ...
of the United States in computers, telecommunications equipment, aircraft, defense hardware, automobiles, space technology, and other key areas could well go the way of the consumer electronics business. New mechanisms and policies must be developed to support and stimulate domestic materials suppliers to work closely with electronics systems houses in long-range programs aimed at recapturing world leadership.
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