Reliability of Adhesive Bonds Under Severe Environments (1984) / Chapter Skim
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'SUMMARY OF DISCUSSION: CHEMISTRY'
'SUMMARY OF DISCUSSION: CHEMISTRY'
Pages 27-30
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From page 27... ...
Although the discussion centered on the chemistry of adhesives, it was well recognized that there are many important parameters to be considered in a bonded joint. These include items such as adherend, surface treatment, interface, primer, carrier, filler, adhesive tape character, cure conditions, joint design, stress loads, environment, and failure mode.
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From page 28... ...
with low volatile content, whereas considerable volatiles are evolved during the fabrication of bonded areas with FBI. The adhesive chemistry group recommends that other known hightemperature polymers be evaluated as adhesives for use in the 538 to 760°C temperature range.
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From page 29... ...
A variety of epoxies are used as RT curing resins for field and depot repair of damaged components. Problems associated with epoxies include moisture sensitivity, long cure time, and limited shelf life.
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