Marshaling Technology for Development Proceedings of a Symposium (1995) / Chapter Skim
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Lessons from the Evolution of Electronics Manufacturing Technologies
Lessons from the Evolution of Electronics Manufacturing Technologies
Pages 161-174
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From page 161... ...
FORCES AFFECTING ELECTRONICS MANUFACTURING TECHNOLOGY Three main forces are driving innovation in electronics manufacturing technology: information technology, globalization, and intensified competition. The major trends in information technologies-electronics photonics, speech process, video, computing, telecommunications, software, and terminals are described in "Information Technology for Development" by John S
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From page 162... ...
Globalization, the second force affecting innovations in manufacturing technology, has changed the context for manufacturing decisions in electronic assembly. Manufacturing operations can no longer exist effectively as stand-alone entities because they must depend heavily on their global supply base for components, manufacturing infrastructure, and the development of manufacturing processes.
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From page 163... ...
Furthermore, because the advantages of proprietary technologies have been disappearing, and the returns on sales, revenue growth, and product life cycles have been declining at double-digit rates,3 successful global manufacturing operations must leverage their learning and integration across their entire production network where capabilities and learning are done globally. This in turn implies that each location will depend heavily on the skills and resources at other locations.
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From page 164... ...
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From page 165... ...
In addition, layers of bureaucracy and many manufacturing costs can be eliminated. Yet, perhaps more important, workers are better able to adapt to the fast pace of technology change, thereby producing a more agile organization seeking to continually improve its ability to thrive in a competitive environment of continuous and unanticipated change while nimbly responding to rapidly changing, customer-driven markets.
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From page 166... ...
for manufacturing operations to six sigma goals for entire manufacturing lines. Leading-edge manufacturing operations will have performance levels that qualify for recognition by government and international quality awards for example, the Deming Prize, European Quality Award, and Baldrige Award.
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From page 167... ...
In packaging, electronics manufacturing technology is evolving quickly to keep pace with the silicon density revolution. The trend toward finer pitch and denser electronic assemblies has enabled moves toward densification to provide more functionality in the same space and miniaturization to produce a product that is smaller than similar products of the recent past.
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From page 168... ...
O-~ Through Hole Surface Mount Fine Pitch /Thin PIN PGA DIPS PLCC QFP SOJ Small outline J-shaped leads package SSOP Shrink small outline package TSOP Thin small outline package Electrical interconnect points Pin grid array Dual in-line packages Plastic leaded chip carrier Quad flat pack (Type 1) Memory MOP Multichip package BGA Ball grid array UTSOP Ultra-thin small outline package PCMCIA Personal computer memory card international association TSSOP Thin shrink small outline package MOM Multichip module TAB Tape automated bonding FIGURE 2 The evolution of packaging.
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From page 169... ...
Technical information is readily available at trade shows and training centers and through various associations such as the Society of Manufacturing Engineers, Surface Mount Equipment Manufacturers Association, Institute of Electrical and Electronics Engineers, and NEPCON electronics exhibitions. Significant improvements in processes become well known and available relatively quickly, yet the performance of a manufacturing operation is driven primarily by the effective integration of many processes and operating procedures, for which the integration capabilities or recipes generally are not readily available and, in reality, are dependent on the competencies in the manufacturing operation.
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From page 170... ...
Competition to provide advanced consumer electronics products to the marketplace has led companies to capitalize on the advantages of closer manufacturing and design organizations and the breaking down of the former walls. Design has evolved from a serial-design/build/test work mode to a model-and-simulate/test-build/verify concurrent engineering approach.
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From page 171... ...
The leveraging requires effective global communication networks, efficient import/export policies, unrestricted travel, joint ventures with greater than 50 percent ownership by foreigners, and localization expectations consistent with realistic economic assessments. The developing countries also can foster the development of a skilled work force, well trained in the quality basics along with the basic sciences.
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From page 172... ...
The value of these products will vary by product family, but the low-technology parts are typically less than 10 percent of the material cost of the final electronic product. The next level of localization requires significantly more technology transfer for such technologies as printed wiring boards and passive components.
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From page 174... ...
SUMMARY In summary, rich information technology, globalization, and ever-increasing global competition are the key forces driving manufacturing technology trends. Recent improvements in manufacturing operations, supplier relationships, concurrent design tools and methodology, and the capabilities of the people who make it all happen should provide insight into the approaches to nurturing manufacturing in any country.
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