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Plasma Processing and Processing Science (1995) / Chapter Skim
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Chapter 3--Semiconductor Processing
Pages 7-12

The Chapter Skim interface presents what we've algorithmically identified as the most significant single chunk of text within every page in the chapter.
Select key terms on the right to highlight them within pages of the chapter.


From page 7...
... sources. This work is driven primarily by the need to operate at lower pressure to reduce the feature size dependence of the etch rate, improve profile control, reduce particulate formation, reduce residues and sidewall passivation layers, and reduce surface damage by controlling the ion and electron energies.
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From page 8...
... At this time most of the surface cleaning steps are still being performed using traditional wet methods. These methods are incompatible with the goal of complete vacuum cluster processing and with environmental considerations.
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From page 9...
... Programs in this arena could include analysis of film properties for microelectronic technologies and the effects of ion bombardment and radiation damage thereon, development of surface structures and novel materials, and scientific issues such as reaction mechanisms and avoidance of process problems during plasma processing. Some topics in this arena are issues relating to the following: The mechanism of diamond film deposition; · Organometallic vapor phase epitaxy; Stress-free dielectric films; 9 .
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From page 10...
... . A host of enhanced plasma tools and processes is now in clevelopment, including helical wave and helicon resonance reactors, magnetically enhanced reactive ion etchers, ECR plasmas, and inductively coupled plasmas.
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From page 11...
... vendors and would open opportunities for cooperative efforts with 11 NRL researchers in designing lower-cost mockup tools. Sensor Development for Control and Fingerprinting of Manufacturing Processes It is rapidly becoming evident that robust manufacturing processes for advanced technologies require real-time process control for cost-containment and product assurance.
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From page 12...
... This program resulted in the development and testing of a wide range of process control sensors, many of which involvect optical diagnostic measurements in plasma processes. Ellipsometry, a conventional technique sensitive to thin film structures, but previously considered too slow for real-time monitoring, was greatly expanded ant!
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Key Terms

  • sensor development
  • ecr technology
  • process control
  • sidewall passivation
  • vapor deposition

  • diagnostic techniques
  • plasma processes
  • tool vendors
  • manufacturing processes
  • microelectronics industry

  • etch rate
  • semiconductor manufacturing
  • feature size
  • cooperative efforts
  • nrl researchers

  • ion bombardment
  • diagnostic measurements
  • surface cleaning
  • reactive species
  • laboratory prototype

  • reactive ion
  • outside partners
  • size dependence
  • profile control
  • proprietary concerns

  • domestic microelectronics
  • cluster processing
  • mmst program
  • chemical vapor
  • funded initiatives


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