Skip to main content

Beam Technologies for Integrated Processing (1992) / Chapter Skim
Currently Skimming:

2 SUMMARY AND RECOMMENDATIONS
Pages 3-8

The Chapter Skim interface presents what we've algorithmically identified as the most significant single chunk of text within every page in the chapter.
Select key terms on the right to highlight them within pages of the chapter.


From page 3...
... Beam technologies are used extensively in integrated circuit manufacturing for materials deposition, to improve the thickness and compositional uniformity of metals, dielectrics, and semiconducting materials deposited on substrates. Over the past 10 years, in order to obtain product uniformity and quality while achieving size reduction, sputtering has replaced evaporation for metals deposition in integrated circuits, and low-pressure chemical vapor deposition has given significant improvements for dielectric materials, metals, and polysiIicon deposits.
Read the entire page →
From page 4...
... Enhanced CVD processes have taken the form of either thermally assisted CVD or PACVD for thermal and electron excitation deposition, particularly for selective-area deposition. The plasma- or photon-assisted CVD process is quite useful in depositing ceramic coatings (Si3N4, SiC, A1N, A12O3, etc.)
Read the entire page →
From page 5...
... The advantages of a laser in an integrated processing system for forming shapes are the short interaction times, high flexibility, and ease of on-line inspection and process control. A commercial process already has been developed using lasers for hole drilling and sheet cutting; presently, sheet metal cutting accounts for the largest fraction of CO2 laser sales.
Read the entire page →
From page 6...
... Some important considerations for expanding integrated beam processing systems are as · more studies to better understand the process steps so that the proper experimental variables can be measured and process simulation models developed, · development of computer algorithms based on simulation models coupled with expert system artificial intelligence techniques to develop smart control programs, · education of students with cross-disciplinary skills to undertake the above items, and · foster team building between equipment vendors and materials processors. RECOMMENDATIONS The committee concludes that all of the beam technologies treated in this report are capable of incorporation into fully integrated processing systems.
Read the entire page →
From page 7...
... ~ Develop process models: An element required in machine control is the availability of accurate process models and simulations. These are essential to properly interpret sensor readings and thereby issue control commands.
Read the entire page →

Key Terms

  • process steps
  • silicon carbide
  • integrated processing
  • vapor deposition
  • using beam

  • beam processing
  • chemical vapor
  • integrated beam
  • synthesized using
  • boron nitride

  • gallium arsenide
  • simulation models
  • integrated circuits
  • ion implantation
  • reactive evaporation

  • carbide whiskers
  • cubic boron
  • process information
  • element required
  • develop advanced

  • computer algorithms
  • extending flexible
  • selective materials
  • uniform control
  • dielectric materials

  • close communications
  • perform multiple
  • worth mentioning
  • impurity profiles
  • condensation process


    • This material may be derived from roughly machine-read images, and so is provided only to facilitate research.
    More information on Chapter Skim is available.