Beam Technologies for Integrated Processing (1992) / Chapter Skim
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6 INTEGRATED PROCESSING
6 INTEGRATED PROCESSING
Pages 71-80
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From page 71... ...
Integration of process steps and processing equipment is only beginning to occur in this industry, where the traditional processing techniques are batch oriented. Most of the process steps and process controls are centered around individual pieces of equipment in which the particular deposition, etching, patterning, and heating steps occur.
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From page 72... ...
Traditional Integrated Circuit Processing Techniques The reasons for the existence of a batch process flow relate to the economics of achieving cost-effective equipment utilization and throughput for time-consuming steps such as oxidation and diffusion and the economics of batch processing in wet chemical steps such as cleaning, etching, and photoresist removal. The capital equipment costs and throughput limitations of these steps still heavily favor batch processing whenever they are used.
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From page 73... ...
The etching of multilayer films, followed by photoresist strip, is a typical application for such cluster tools. The development of integrated processing tools to do more complex fabrication sequences is limited by many factors, such as development cost, range of process expertise, unknown market requirements, and lack of equipment interface standards.
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From page 74... ...
Applications for Integrated Processing Tools In evaluating potential uses for integrated processing tools, an assumption is made that the photolithographic steps will be done on optical steppers employing photoresist technology and wet chemical development. This means that each masking step will be done outside an enclosedenvironment beam processing tool.
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From page 75... ...
. CVD Tungsten Deposition 5 Dielectric Etch and Metal Deposibon with Via Fill Sequence 1 Wafer load 5 CVD W Deposibon 2 Plasma Oxide Etch 6 Tungsten Etd~back 3 Reset Sap 7 Aluminum Deposibon 4 Sputter Clean and 8 Wafer Unload Nucleation Layer Deposibon Figure 6-1 Examples of integrated processing sequences.
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From page 76... ...
Beam processes, which were described in Chapter 3, have several characteristics that favor their use in integrated processing systems; these include short interaction times, noncontacting functionality, and, in some cases, environmental flexibility. Two specific examples are presented below where beam technologies play important roles in the integration of processing steps: multilayer architectural glass coatings and single and multilayer coatings for stainless steel sheet.
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From page 77... ...
for such applications as oven windows, commercial freezers and refrigerator doors, and copy machine platens (OPTONET: Industry Briefs, 1991~. More recent in-line coating systems use the sputtering process with the glass transported horizontally or vertically depending on the individual design.
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From page 78... ...
Stainless steel sheets of 0.1 to 0.5 mm thickness, 370 mm width, and 300 m length move through the chambers at a web speed of 0.01 to 0.4 m per minute (Hashimoto et al., 1988~. Mechanical Fabrication Precision gear manufacture is used here to illustrate how beam technology can be employed to attain a fully integrated processing system for the manufacture of a mechanical component.
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From page 79... ...
1988. Surface Modification of Stainless Steels by In-line Dry Coating Technology.
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